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Fabrication of high performance copper-resin lapping plate for sapphire: A combined 2-body and 3-body diamond abrasive wear on sapphire

Title
Fabrication of high performance copper-resin lapping plate for sapphire: A combined 2-body and 3-body diamond abrasive wear on sapphire
Author
박진구
Keywords
Metal-resin composite plate; Removal rate; Two-body and three-body diamond abrasion; Sapphire lapping
Issue Date
2018-04
Publisher
ELSEVIER SCI LTD
Citation
TRIBOLOGY INTERNATIONAL, v. 120, page. 203-209
Abstract
In this study, a sapphire lapping plate was fabricated using a unique blend of copper (Cu) metal particles and resin to overcome the drawbacks of traditional iron (Fe) and Cu plate lapping. An optimum Cu-resin ratio was found by evaluating the MRR, surface roughness of the lapped sapphire and the hardness of the Cu-resin plate. Cu-resin plates with various groove patterns were prepared, and a suitable pattern was found with respect to MRR and surface roughness of processed sapphire. A new concept of a temporary 2-body and permanent 3-body diamond abrasion mechanism was proposed for the sapphire lapping process using the interface of the Cu-resin plate. The proposed mechanism on sapphire lapping may support future developments in this field.
URI
https://www.sciencedirect.com/science/article/pii/S0301679X17305959?via%3Dihubhttps://repository.hanyang.ac.kr/handle/20.500.11754/118399
ISSN
0301-679X; 1879-2464
DOI
10.1016/j.triboint.2017.12.037
Appears in Collections:
GRADUATE SCHOOL[S](대학원) > BIONANOTECHNOLOGY(바이오나노학과) > Articles
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