Investigation of Wafer Warpage Induced by Multi-layer Films
- Title
- Investigation of Wafer Warpage Induced by Multi-layer Films
- Author
- 박재근
- Keywords
- Warp/bow; multi-layer film; bending; boron/oxygen impurity concentration; site flatness
- Issue Date
- 2018-02
- Publisher
- IEEK PUBLICATION CENTER
- Citation
- JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE, v. 18, no. 1, page. 7-13
- Abstract
- Oxide/poly-Si films were repeatedly grown on one side of 300 mm silicon wafers to induce bending, the extent of which was quantified by warp and bow changes. Bending was affected by crystal properties, wafer shape, and local stress, as well as by oxide layer thickness and heat treatment temperature, being less pronounced for wafers with high boron and oxygen impurity concentrations and those with low initial warp, especially, in the case of negative (concave shape) initial bow. Additionally, we investigated the effect of wire-saw cut bending on site flatness and demonstrated that local area damage such as soft laser marking induced a sudden deterioration of edge flatness.
- URI
- http://www.dbpia.co.kr/journal/articleDetail?nodeId=NODE07399920&language=ko_KRhttps://repository.hanyang.ac.kr/handle/20.500.11754/117583
- ISSN
- 1598-1657; 2233-4866
- DOI
- 10.5573/JSTS.2018.18.1.007
- Appears in Collections:
- COLLEGE OF ENGINEERING[S](공과대학) > ELECTRONIC ENGINEERING(융합전자공학부) > Articles
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