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dc.contributor.author한태희-
dc.date.accessioned2019-11-26T06:01:14Z-
dc.date.available2019-11-26T06:01:14Z-
dc.date.issued2017-06-
dc.identifier.citationMACROMOLECULAR RESEARCH, v. 25, no. 6, page. 559-564en_US
dc.identifier.issn1598-5032-
dc.identifier.issn2092-7673-
dc.identifier.urihttps://link.springer.com/article/10.1007%2Fs13233-017-5114-9-
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/114642-
dc.description.abstractEnhanced heat conduction behavior of epoxy/polyacrylonitrile-based carbon fiber fabric composites was developed through Cu electroplating on carbon fiber fabrics. The polyacrylonitrile-based carbon fiber fabric with low thermal conductivity was employed as a template to form continuous Cu thermal conduction pathway. The epoxy composites with the continuous heat conduction pathway exhibited high thermal conductivities of 7.70 W/mK in the parallel direction, and 0.96 W/mK in the perpendicular direction, even with a lower Cu content of 3.5 vol%, which is a 220% and 70% increase over those of the epoxy/carbon fiber composites with isolated Cu beads, respectively. The experimental thermal conductivities of the composites were compared to the theoretically calculated values based on the Hatta and Taya models. Our simple approach offers a straightforward strategy to enhance thermal conductivity of polymer composites through incorporating the continuous Cu thin layers as an efficient thermal conduction pathway.en_US
dc.description.sponsorshipThis work was supported by a grant from Fundamental R&D Program for Core Technology of Materials and Industrial Strategic Technology Development Program funded by the Ministry of Trade, Industry and Energy, Republic of Korea and was partially supported by the Korea Institute of Science and Technology (KIST) and the research fund of Hanyang University (HY-2013). This research was also supported by Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Science, ICT & Future Planning.en_US
dc.language.isoen_USen_US
dc.publisherSPRINGERen_US
dc.subjectthermal conductivityen_US
dc.subjectlow percolationen_US
dc.subjectcomposite materialsen_US
dc.subjectelectroplatingen_US
dc.subjectCuen_US
dc.subjectcarbon fiberen_US
dc.titleEnhanced thermal conductivity of epoxy/Cu-plated carbon fiber fabric compositesen_US
dc.typeArticleen_US
dc.relation.no6-
dc.relation.volume25-
dc.identifier.doi10.1007/s13233-017-5114-9-
dc.relation.page559-564-
dc.relation.journalMACROMOLECULAR RESEARCH-
dc.contributor.googleauthorYu, Seunggun-
dc.contributor.googleauthorPark, Kyusup-
dc.contributor.googleauthorLee, Jang-Woo-
dc.contributor.googleauthorHong, Soon Man-
dc.contributor.googleauthorPark, Cheolmin-
dc.contributor.googleauthorHan, Tae Hee-
dc.contributor.googleauthorKoo, Chong Min-
dc.relation.code2017001828-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentDEPARTMENT OF ORGANIC AND NANO ENGINEERING-
dc.identifier.pidthan-
dc.identifier.researcherIDE-8590-2015-
dc.identifier.orcidhttp://orcid.org/0000-0001-5950-7103-
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COLLEGE OF ENGINEERING[S](공과대학) > ORGANIC AND NANO ENGINEERING(유기나노공학과) > Articles
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