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Multi-pulse flash light sintering of bimodal Cu nanoparticle-ink for highly conductive printed Cu electrodes

Title
Multi-pulse flash light sintering of bimodal Cu nanoparticle-ink for highly conductive printed Cu electrodes
Author
김학성
Keywords
printed electronics; bimodal Cu nanoparticles; flash light sintering; multi-pulse sintering; adhesion strength and resistivity
Issue Date
2017-05
Publisher
IOP PUBLISHING LTD
Citation
NANOTECHNOLOGY, v. 28, no. 20, Article no. 205205
Abstract
In this work, bimodal Cu nano-inks composed of two different sizes of Cu nanoparticles (NPs) (40 and 100 nm in diameter) were successfully sintered with a multi-pulse flashlight sintering technique. Bimodal Cu nano-inks were fabricated and printed with various mixing ratios and subsequently sintered by a flash light sintering method. The effects of the flashlight sintering conditions, including irradiation energy and pulse number, were investigated to optimize the sintering conditions. A detailed mechanism of the sintering of bimodal Cu nano-ink was also studied via real-time resistance measurement during the sintering process. The sintered Cu nano-ink films were characterized using x-ray photoelectron spectroscopy and scanning electron microscopy. From these results, it was found that the optimal ratio of 40-100 nm NPs was found to be 25:75 wt%, and the optimal multi-pulse flash light sintering condition (irradiation energy: 6 J cm(-2), and pulse duration: 1 ms, off-time: 4 ms, and pulse number: 5) was found. The optimally sintered Cu nano-ink film exhibited the lowest resistivity of 5.68 mu Omega cm and 5B adhesion level.
URI
https://iopscience.iop.org/article/10.1088/1361-6528/aa6cdahttps://repository.hanyang.ac.kr/handle/20.500.11754/114165
ISSN
0957-4484; 1361-6528
DOI
10.1088/1361-6528/aa6cda
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MECHANICAL ENGINEERING(기계공학부) > Articles
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