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dc.contributor.author박대효-
dc.date.accessioned2019-11-24T17:59:39Z-
dc.date.available2019-11-24T17:59:39Z-
dc.date.issued2017-04-
dc.identifier.citationJOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME, v. 139, no. 2, Article no. 021006en_US
dc.identifier.issn0094-4289-
dc.identifier.issn1528-8889-
dc.identifier.urihttp://materialstechnology.asmedigitalcollection.asme.org/article.aspx?articleid=2588603-
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/113799-
dc.description.abstractThe thermodynamically consistent framework accounting for the thermomechanical behavior of the microstructure is addressed using the finite-element implementation. In particular, two different classes of the strain gradient plasticity (SGP) theories are proposed: In the first theory, the dissipation potential is dependent on the gradient of the plastic strain, as a result, the nonrecoverable microstresses do not have a value of zero. In the second theory, the dissipation potential is independent of the gradient of the plastic strain, in which the nonrecoverable microstresses do not exist. Recently, Fleck et al. pointed out that the nonrecoverable microstresses always generate the stress jump phenomenon under the nonproportional loading condition. In this work, a one-dimensional finite-element solution for the proposed strain gradient plasticity model is developed for investigating the stress jump phenomenon. The proposed strain gradient plasticity model and the corresponding finite-element code are validated by comparing with the experimental data from the two sets of microscale thin film experiments. In both experimental validations, it is shown that the calculated numerical results of the proposed model are in good agreement with the experimental measurements. The stretch-passivation problems are then numerically solved for investigating the stress jump phenomenon under the nonproportional loading condition.en_US
dc.description.sponsorshipThe first author was partially funded by the NSF EPSCoR CIMM project under Award No. OIA-1541079.en_US
dc.language.isoen_USen_US
dc.publisherASMEen_US
dc.subjectTHIN-FILMen_US
dc.subjectDEFORMATIONen_US
dc.subjectVISCOPLASTICITYen_US
dc.subjectACCOUNTSen_US
dc.subjectBAUSCHINGERen_US
dc.subjectFRAMEWORKen_US
dc.titleHigher-order thermomechanical gradient plasticity model with energetic and dissipative componentsen_US
dc.typeArticleen_US
dc.relation.no2-
dc.relation.volume139-
dc.identifier.doi10.1115/1.4035293-
dc.relation.page100611-100612-
dc.relation.journalJOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME-
dc.contributor.googleauthorVoyiadjis, George Z.-
dc.contributor.googleauthorSong, Yooseob-
dc.contributor.googleauthorPark, Taehyo-
dc.relation.code2017000064-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentDEPARTMENT OF CIVIL AND ENVIRONMENTAL ENGINEERING-
dc.identifier.pidcepark-
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > CIVIL AND ENVIRONMENTAL ENGINEERING(건설환경공학과) > Articles
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