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dc.contributor.author허선-
dc.date.accessioned2019-11-21T06:34:13Z-
dc.date.available2019-11-21T06:34:13Z-
dc.date.issued2019-04-
dc.identifier.citation2019년 대한산업공학회 춘계공동학술대회 논문집, Page. 942 - 967en_US
dc.identifier.urihttp://www.dbpia.co.kr/journal/articleDetail?nodeId=NODE08009235&language=ko_KR-
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/113227-
dc.language.isoko_KRen_US
dc.publisher대한산업공학회en_US
dc.title심층 Q-네트워크를 활용한 반도체 접착 공정의 최적 이동경로 탐색en_US
dc.typeArticleen_US
dc.relation.page1-11-
dc.contributor.googleauthor박명환-
dc.contributor.googleauthor허선-
dc.sector.campusE-
dc.sector.daehakCOLLEGE OF ENGINEERING SCIENCES[E]-
dc.sector.departmentDEPARTMENT OF INDUSTRIAL AND MANAGEMENT ENGINEERING-
dc.identifier.pidhursun-
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COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > INDUSTRIAL AND MANAGEMENT ENGINEERING(산업경영공학과) > Articles
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