Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 안강호 | - |
dc.date.accessioned | 2019-09-05T01:52:24Z | - |
dc.date.available | 2019-09-05T01:52:24Z | - |
dc.date.issued | 2005-03 | - |
dc.identifier.citation | 반도체및디스플레이장비학회지, v. 4, No. 1, Page. 49 - 53 | en_US |
dc.identifier.uri | http://www.ndsl.kr/ndsl/search/detail/article/articleSearchResultDetail.do?cn=JAKO200508824106032 | - |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/110249 | - |
dc.description.abstract | The nanoparticle deposition chamber, which is used for quantum dot semiconductor memory applications, is designed by means of numerical simulation. In this research, the numerical simulations for deposition chamber were performed by commercial software, FLUENT. The deposition of nanoparticles is calculated by diffusion force, thermophoresis and electrophoresis of particles. As a results, when the diffusion force was considered, the most of particles deposited in the wall of deposition chamber. But as considering thermophoresis and electrophoresis of particles, the particles were deposited wafer surface, perfectly. | en_US |
dc.language.iso | ko_KR | en_US |
dc.publisher | 반도체및디스플레이장비학회 | en_US |
dc.subject | Deposition Chamber | en_US |
dc.subject | Diffusion | en_US |
dc.subject | Electrophoresis | en_US |
dc.subject | Nanoparticles | en_US |
dc.subject | Numerical Simulation | en_US |
dc.subject | Thermophoresis | en_US |
dc.subject | Wafer | en_US |
dc.title | 300mm 웨이퍼 위의 에어로졸 나노 입자의 증착장비 개발을 위한 수치 해석적 연구 | en_US |
dc.title.alternative | Numerical Simulation of Deposition Chamber for Aerosol Nanoparticles Upward 300 mm Wafer | en_US |
dc.type | Article | en_US |
dc.relation.journal | 한국반도체장비학회지 | - |
dc.contributor.googleauthor | 안강호 | - |
dc.contributor.googleauthor | 안진홍 | - |
dc.contributor.googleauthor | 이관수 | - |
dc.contributor.googleauthor | 임광옥 | - |
dc.contributor.googleauthor | 강윤호 | - |
dc.relation.code | 2012210661 | - |
dc.sector.campus | E | - |
dc.sector.daehak | COLLEGE OF ENGINEERING SCIENCES[E] | - |
dc.sector.department | DEPARTMENT OF MECHANICAL ENGINEERING | - |
dc.identifier.pid | khahn | - |
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