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Highly integrated 10Gb/s optical sub-assembly and its circuit modeling

Title
Highly integrated 10Gb/s optical sub-assembly and its circuit modeling
Author
심종인
Keywords
10 Gb/s small form factor pluggable (XFP); Distributed feedback laser diode (DFB-LD); Semiconductor device packaging; Transmitter optical sub-assemble (TOSA)
Issue Date
2006-10
Publisher
SPIE
Citation
Proceedings of SPIE - The International Society for Optical Engineering, v. 6352, Article no. 63520D
Abstract
A highly integrated 10 Gb/s transmitter optical sub-assembly was fabricated and characterized for XFP transceiver. As a light source, uncooled 1.3 μm high-speed distributed feedback laser diode (DFB-LD) was fabricated and assembled on AlN sub-mount with a monitoring PD, a matching-resistor, and a bias-Tee with spiral-inductor. A glass sealed metallic low-loss TO-stem with in-line leads was newly presented. We developed a small-signal equivalent circuit model based on measured S-parameters in order to verify RF characteristics of LD and passive components. The eye-diagram of 10 Gb/s NRZ patterns with a PRBS 231-1 was opened clearly without mask violation. At 85°C, -3-dB bandwidth was measured as high as 11 GHz and 75-km transmission was successfully achieved with very low penalty.
URI
https://www.spiedigitallibrary.org/conference-proceedings-of-spie/6352/63520D/Highly-integrated-10Gb-s-optical-sub-assembly-and-its-circuit/10.1117/12.687391.full?SSO=1https://repository.hanyang.ac.kr/handle/20.500.11754/108517
ISSN
0277-786X
DOI
10.1117/12.687391
Appears in Collections:
COLLEGE OF SCIENCE AND CONVERGENCE TECHNOLOGY[E](과학기술융합대학) > PHOTONICS AND NANOELECTRONICS(나노광전자학과) > Articles
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