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Ag 코팅한 W-Ag 전기접점/Cu 모재간의 브레이징 접합 특성

Title
Ag 코팅한 W-Ag 전기접점/Cu 모재간의 브레이징 접합 특성
Other Titles
Brazing Adhesion Properties of Ag Coated W-Ag Electric Contact on the Cu Substrate
Author
이재성
Keywords
W-Ag electric contact; BCuP-5; Filler-metal; Brazing; Adhesion test
Issue Date
2006-02
Publisher
한국분말야금학회
Citation
한국분말야금학회지, v. 13, No. 1, Page. 18-24
Abstract
The brazing adhesion properties of Ag coated W-Ag electric contact on the Cu substrate have been investigated in therms of microstructure, phase equilibrium and adhesion strength. Precoating of Ag layer ( in thickness) on the contact material was done by electro-plating method. Subsequently the brazing treatment was conducted by inserting BCuP-5 filler metal (Ag-Cu-P alloy) layer between Ag coated W-Ag and Cu substrate and annealing at in atmosphere. The optimum brazing temperature of was semi-empirically calculated on the basis of the Cu atomic diffusion profile in Ag layer of commercial electric contact produced by the same brazing process. As a mechanical test of the electric contact after brazing treatment the adhesion strength between the electric contact and Cu substrate was measured using Instron. The microstructure and phase equilibrium study revealed that the sound interlayer structure was formed by relatively low brazing treatment at . Thin Ag electro-plated layer precoated on the electric contact ( in thickness) is thought to be enough for high adhesion strength arid sound microstructure in interface layer.
URI
http://db.koreascholar.com/Article?code=2464https://repository.hanyang.ac.kr/handle/20.500.11754/107704
ISSN
2287-8173; 1225-7591
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
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