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Process Extension Techniques for Optical Lithography: Thermal Treatment, Polarization and Double Patterning

Title
Process Extension Techniques for Optical Lithography: Thermal Treatment, Polarization and Double Patterning
Author
오혜근
Keywords
lithography; lithography simulation; thermal treatment; polarization; double patterning
Issue Date
2007-10
Publisher
KOREAN PHYSICAL SOC
Citation
JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v. 51, No. 4, Page. 1413-1418
Abstract
Current 193-nm optical lithography and commercially available 193-nm resists have been pushed far beyond the previously expected critical dimension by using process extension technology for resolution enhancement technology. This paper deals with three kinds of process extension technologies, thermal treatment, polarization, and double patterning. These technologies are modeled and analyzed. If a 50 % pattern shrinkage due to thermal treatment, a 25 % resolution enhancement due to polarization, and a 50 % pattern shrinkage due to double patterning are supposed, an effective combination can generate a sub-50-nm pattern. When the pattern size is smaller, optical proximity effects are more severe. After describing optical proximity effects for each of these technologies, we discuss optical proximity correction methods.
URI
http://www.jkps.or.kr/journal/view.html?uid=8915&vmd=Fullhttps://repository.hanyang.ac.kr/handle/20.500.11754/107080
ISSN
0374-4884
DOI
10.3938/jkps.51.1413
Appears in Collections:
COLLEGE OF SCIENCE AND CONVERGENCE TECHNOLOGY[E](과학기술융합대학) > APPLIED PHYSICS(응용물리학과) > Articles
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