Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 이동희 | - |
dc.date.accessioned | 2019-05-23T06:50:03Z | - |
dc.date.available | 2019-05-23T06:50:03Z | - |
dc.date.issued | 2017-01 | - |
dc.identifier.citation | ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, v. 6, no. 1, page. 42-44 | en_US |
dc.identifier.issn | 2162-8769 | - |
dc.identifier.uri | http://jss.ecsdl.org/content/6/1/P42 | - |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/105942 | - |
dc.description.abstract | We have investigated the synergistic effect with mixing of three different-sized SiO2 abrasives (30 nm-SiO2, 70 nm-SiO2 and 200 nm-SiO2) and the correspondingWchemical mechanical planarization (CMP) performances. Wremoval rate significantly increased when the different-sized SiO2 abrasives were mixed, which is attributed to the increase in the total contact area between the abrasives and the W film. Based on the statistical model, we obtained the optimal mixing ratio (30 nm, 70 nm, 200 nm) = (0.49, 0.23, 0.28) for the highest W removal rate. These results, investigated in this study, show that the removal rate of W film can be improved via simple mixing process. (C) 2016 The Electrochemical Society. All rights reserved. | en_US |
dc.language.iso | en | en_US |
dc.publisher | ELECTROCHEMICAL SOC INC | en_US |
dc.subject | CHEMICAL-MECHANICAL PLANARIZATION | en_US |
dc.subject | ABRASIVES | en_US |
dc.title | Communication-Synergistic Effect of Mixed Particle Size on W CMP Process: Optimization Using Experimental Design | en_US |
dc.type | Article | en_US |
dc.relation.no | 1 | - |
dc.relation.volume | 6 | - |
dc.identifier.doi | 10.1149/2.0171701jss | - |
dc.relation.page | 42-44 | - |
dc.relation.journal | ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY | - |
dc.contributor.googleauthor | Seo, Jihoon | - |
dc.contributor.googleauthor | Moon, Jinok | - |
dc.contributor.googleauthor | Kim, Yehwan | - |
dc.contributor.googleauthor | Kim, Kijung | - |
dc.contributor.googleauthor | Lee, Kangchun | - |
dc.contributor.googleauthor | Cho, Yoonsung | - |
dc.contributor.googleauthor | Lee, Dong-Hee | - |
dc.contributor.googleauthor | Paik, Ungyu | - |
dc.relation.code | 2017011825 | - |
dc.sector.campus | S | - |
dc.sector.daehak | DIVISION OF INDUSTRIAL INFORMATION STUDIES[S] | - |
dc.sector.department | DIVISION OF INDUSTRIAL INFORMATION STUDIES | - |
dc.identifier.pid | dh | - |
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