HoP-iPD 출력 매칭 회로를 적용한 2mm × 2mm 크기의 WCDMA 단말기용 마이크로파 전력 증폭기 개발

Abstract

An ultra small form-factor power amplifier (PA) module was developed for WCDMA handset applications. To reduce the size of the PA module, the bulky transmission lines and lumped chip elements of the conventional output matching network (OMN) were replaced with the proposed helix-on-pad (HoP) and an integrated passive device (iPD), respectively. Using the proposed HoP-iPD OMN, a 2 mm x 2 mm single-band PA module was implemented for UMTS Band-5 applications without RF performance degradation.