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The Effects of Bath Temperature on the Formation of Nanotwin in Electrodeposited Cu

Title
The Effects of Bath Temperature on the Formation of Nanotwin in Electrodeposited Cu
Author
유봉영
Keywords
Bath Temperature; Diffusion Coefficient; Nanotwinned Cu; Nanotwins; Pulse Electrodeposition; MAXIMUM STRENGTH; COPPER; NANOSCALE; FILM
Issue Date
2016-11
Publisher
AMER SCIENTIFIC PUBLISHERS
Citation
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v. 16, No. 11, Page. 11303-11307
Abstract
Cu films with high mechanical strength and low electrical resistivity are required in various industrial fields, and nanotwinned Cu is a strong candidate to satisfy these requirements due to its extraordinary microstructures. The formation mechanism and the effect of deposition parameters on the formation of nanotwinned Cu have been intensively investigated. In this research, the effects of bath temperature on the formation of nanotwinned Cu in pulse current electrodeposition is studied. Although the variations in bath temperature are as small as 30 degrees C (from 40 degrees C to 10 degrees C), the tensile strength increased by similar to 56% (479 MPa to 745 MPa) without significant degradation of elongation and electrical conductivity. In addition, an increase in nanotwin density was observed in the sample deposited at low temperature. The diffusion coefficient of Cu+2 ions, overpotential, and residual Cu film stress were measured to investigate the effects of bath temperature.
URI
http://www.ingentaconnect.com/contentone/asp/jnn/2016/00000016/00000011/art00034https://repository.hanyang.ac.kr/handle/20.500.11754/102987
ISSN
1533-4880
DOI
10.1166/jnn.2016.13498
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
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