소홍윤
2018-03-05T04:11:40Z
2018-03-05T04:11:40Z
2013-10
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS,2013,21(1), p195-202
0946-7076
https://link.springer.com/article/10.1007%2Fs00542-013-1953-2
http://hdl.handle.net/20.500.11754/42244
This paper reports on a novel thermal actuator with sub-micron metallic structures and a buckling arm to operate with low voltages and to generate very large deflections, respectively. A lumped electrothermal model and analysis were also developed to validate the mechanical design and easily predict the temperature distribution along arms of the sub-micron actuator. The actuator was fabricated via the combination of electron beam lithography to form actuator arms with a minimum feature size of 200 nm and lift-off process to deposit a high aspect ratio nickel structure. Reproducible displacements of up to 1.9 mu m at the tip were observed up to 250 mV under confocal microscope. The experimentally measured deflection values and theoretically calculated temperature distribution by the developed model were compared with finite element analysis results and they were in good agreement. This study shows a promising approach to develop more sophisticated nano actuators required larger deflections for manipulation of sub-micron scale objects with low-power consumption.
Department of Mechanical Engineering, Berkeley Sensor & Actuator Center, University of California, Berkeley,CA 94720, USA
en
SPRINGER, 233 SPRING ST, NEW YORK, NY 10013 USA
MICRO-ACTUATORS
MICROACTUATORS
SILICON
DESIGN
Electrothermal modeling, fabrication and analysis of low-power consumption thermal actuator with buckling arm
Article
10.1007/s00542-013-1953-2
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS
So, Hong-Yun
Pisano, Albert P.
2013011306
S
COLLEGE OF ENGINEERING[S]
DIVISION OF MECHANICAL ENGINEERING
hyso
55901410900