박성주
2019-03-08T05:56:40Z
2019-03-08T05:56:40Z
2015-05
2015 20th IEEE European Test Symposium (ETS), Article no. 7138767
978-1-4799-7603-4
1530-1877
1558-1780
http://ieeexplore.ieee.org/document/7138767
https://repository.hanyang.ac.kr/handle/20.500.11754/100649
The semiconductor aging is one of the serious threats for the reliability of the system. This paper presents an efficient mechanism for predicting the aging effect. The captured data will be unloaded by shift operation, then verified through the aging monitoring operation. Especially the aging level of automotive semiconductor devices can be estimated by controlling the capture timing. Since the aging monitoring function is efficiently on and off during normal operation, power consumption can be reduced significantly compared with other approaches.
en_US
IEEE
aging monitoring
scan flip-flop
on-line test
Efficient Diagnosis Technique for Aging Defects on Automotive Semiconductor Chips
Article
10.1109/ETS.2015.7138767
1-2
Jung, Jihun
Ansari, Muhammad Adil
Kim, Dooyoung
Yi, Hyunbean
Park, Sungju
E
COLLEGE OF COMPUTING[E]
DIVISION OF COMPUTER SCIENCE
paksj