| 2011-03 | Electrochemical albumin sensing based on silicon nanowires modified by gold nanoparticles | 김영호 |
| 2019-03 | Electromigration reliability of Sn–3.0Ag–0.5Cu/Cu–Zn solder joints | 김영호 |
| 2017-12 | Enhanced Bonding by Applied Current in Cu-to-Cu Joints Fabricated Using 20 mu m Cu Microbumps | 김영호 |
| 2020-01 | Epoxy/silane pre-synthesis improving thermal properties and adhesion strength of silica-filled non-conductive adhesive for fine-pitch thermocompression bonding | 김영호 |
| 2012-04 | Fabrication of Copper Nanoparticles in a Thick Polyimide Film Cured by Rapid Thermal Annealing | 김영호 |
| 2012-11 | Facile synthesis of porous-carbon/LiFePO4 nanocomposites | 김영호 |
| 2013-05 | Flip chip bonding with anisotropic conductive film (ACF) and nonconductive adhesive (NCA) | 김영호 |
| 2012-01 | Formation of Ag Nanostrings Induced by Lyotropic Liquid Crystalline Phospholipid Multilayer | 김영호 |
| 2015-09 | The formation of Cu2O nanoparticles in polyimide using Cu electrodes via chemical curing, and their application in flexible polymer memory devices | 김영호 |
| 2011-04 | Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn/Cu bumps and non-conductive adhesives | 김영호 |
| 2013-09 | Hydroxyapatite 피복된 ABG I 삽입물을 이용한 무시멘트 인공 고관절 전치환술 : 최소 10년 이상 추시 결과 | 김영호 |
| 2015-05 | Improved drop reliability of Sn-Ag-Cu solder joints by Zn addition to a Cu wetting layer | 김영호 |
| 2011-05 | Improved Light Extraction Efficiency of InGaN-Based Multi-Quantum Well Light Emitting Diodes by Using a Single Die Growth | 김영호 |
| 2015-11 | Improvement of the adhesion between polyaniline and commercial carbon paper by acid treatment and its application in supercapacitor electrodes | 김영호 |
| 2011-01 | In(2)O(3) Nanocrystal Memory with the Barrier Engineered Tunnel Layer | 김영호 |
| 2018-09 | The incidence of hip dislocation and suture failure according to two different types of posterior soft tissue repair techniques in total hip arthroplasty: a prospective randomized controlled trial | 김영호 |
| 2012-04 | Interface Analysis of Embedded Chip Resistor Device Package and Its Effect on Drop Shock Reliability | 김영호 |
| 2013-06 | Interfacial reactions between Sn-3.0Ag-0.5Cu solder and Cu-xZn (x=0-35 wt%) or Cu-xZn-yNi (x=20 and 25 wt%, y=15 and 10 wt%) substrates | 김영호 |
| 2012-08 | Intermetallic compound formation in the interface between SAC305 solder and Cu-xZn-yNi substrates | 김영호 |
| 2012-12 | Is bipolar hemiarthroplasty a reliable option for Ficat stage III osteonecrosis of the femoral head? 15-to 24-year follow-up study | 김영호 |
| 2014-12 | Isolated Acetabular Revision With Ceramic-on-Ceramic Bearings Using a Ceramic Head With a Metal Sleeve | 김영호 |
| 2018-07 | Long-Term Outcomes After Metal-on-Metal Total Hip Arthroplasty With a 28-mm Head: A 17-to 23-Year Follow-Up Study of a Previous Report | 김영호 |
| 2015-12 | Low temperature chip on film bonding technology for 20 mu m pitch applications | 김영호 |
| 2015-07 | Mechanical and electrical stability of PEDOT: PTS and Au source/drain electrodes for bottom contact OTFTs on plastic films under bending conditions | 김영호 |
| 2016-10 | A peel adhesion study of electroless Cu layers on polymer substrates | 김영호 |
| 2019-03 | Prevalence and natural course of pseudotumours after small-head metal-on-metal total hip arthroplasty A MINIMUM 18-YEAR FOLLOW-UP STUDY OF A PREVIOUS REPORT | 김영호 |
| 2014-12 | Prevalence of a soft-tissue lesion after small head metal-on-metal total hip replacement: 13-to 19-year follow-up study | 김영호 |
| 2017-06 | Process enabling highly accurate die position for fan-out package applications | 김영호 |
| 2019-07 | Psychological Changes and Employment Outcomes After Kyphosis Correction in Patients With Ankylosing Spondylitis | 김영호 |
| 2014-02 | Reliability of Cu to Cu joints fabricated using SnAg capping layer for 3D applications | 김영호 |
