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dc.contributor.author김희준-
dc.date.accessioned2019-02-20T06:30:25Z-
dc.date.available2019-02-20T06:30:25Z-
dc.date.issued2018-04-
dc.identifier.citationIEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, v. 28, No. 3, Article no. 1100105en_US
dc.identifier.issn1051-8223-
dc.identifier.issn1558-2515-
dc.identifier.urihttps://ieeexplore.ieee.org/abstract/document/8259285-
dc.identifier.urihttp://repository.hanyang.ac.kr/handle/20.500.11754/99124-
dc.description.abstractThis paper describes the construction of an embedded flexible inductor using Fe-Si-Al powder composite films with a mu(r) of 140, and proposes a low-power dc-dc converter using this inductor. The fabricated composite films are composed of mixed 85% Fe-9% Si-6% Al flaked powders, and ethylene propylene diene monomer rubber, which is a terpolymer with rigid polymer structure used in low-power applications. The proposed flexible inductor is simulated using Maxwell three-dimensional tool and measured out by folding the fabricated flexible inductor (to 0 degrees, 45 degrees, 90 degrees, and above 90 degrees). It has also been confirmed that the inductance of a flexible inductor has good linearity at a high frequency of several MHz. To verify its usefulness, the proposed inductor with dimensions of 10 mm x 7 mm x 0.28 mm was applied to a dc-dc boost converter fabricated on a flexible printed circuit board of size 10 mm x 23 mm x 0.16 mm. The output power of the fabricated dc-dc boost converter was 2 W (5 V/400 mA) and the switching frequency was fixed at 1.2 MHz. On testing, the fabricated dc-dc boost converter recorded a maximum efficiency of 84%. Additionally, the flexibility of the fabricated embedded flexible inductor was verified by folding it (to 0 degrees, 45 degrees, 90 degrees, and above 90 degrees). Thus, the excellent flexibility of the fabricated embedded flexible inductor was proved.en_US
dc.description.sponsorshipThis work was supported in part by the Institute for Information & Communication Technology Promotion grant funded by the Korea government (MSIP) [B0126-15-1071, Development of the Ultra High Density PSiP (Power Supply in Package Technology for High Frequency Drive)], and in part by the Small & Medium Business Administration/Industrial Technology Innovation Project (World Class 300 Project R&D) under Project 10050459.en_US
dc.language.isoen_USen_US
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCen_US
dc.subjectFlexible inductoren_US
dc.subjectFe-Si-Al powder composite filmen_US
dc.subjectflexibilityen_US
dc.subjectflexible boost converteren_US
dc.subjectinductor embedded DC-DC boost converteren_US
dc.titleEmbedded Flexible Fe–Si–Al Powder Composite Film Inductor for Low Power DC–DC Convertersen_US
dc.typeArticleen_US
dc.relation.volumeVOL. 28, NO. 3-
dc.identifier.doi10.1109/TASC.2018.2793918-
dc.relation.page105-109-
dc.relation.journalIEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY-
dc.contributor.googleauthorLim, Jae-Woo-
dc.contributor.googleauthorKim, Hee-Jun-
dc.contributor.googleauthorOh, Yong-Seung-
dc.contributor.googleauthorKim, Hyung-Sik-
dc.contributor.googleauthorLim, Sung-Tae-
dc.relation.code2018000194-
dc.sector.campusE-
dc.sector.daehakCOLLEGE OF ENGINEERING SCIENCES[E]-
dc.sector.departmentDIVISION OF ELECTRICAL ENGINEERING-
dc.identifier.pidhjkim-
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > ELECTRICAL ENGINEERING(전자공학부) > Articles
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