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dc.contributor.author이선영-
dc.date.accessioned2019-01-07T02:34:42Z-
dc.date.available2019-01-07T02:34:42Z-
dc.date.issued2018-06-
dc.identifier.citationTHIN SOLID FILMS, v. 656, Page. 61-67en_US
dc.identifier.issn0040-6090-
dc.identifier.urihttps://www.sciencedirect.com/science/article/pii/S0040609018302967-
dc.identifier.urihttp://repository.hanyang.ac.kr/handle/20.500.11754/81089-
dc.description.abstractCopper nanoparticles were protected against oxidation by coating with 1-octanethiol. The copper nano-ink was synthesized by dispersing the coated copper powder in 1-octanol solvent at a concentration of 18wt%. Inkjet patterns printed on a flexible polyimide film and subjected to flash-light sintering displayed excellent anti-oxidation behavior over 2 months. The optimal light-sintering condition was 24.7 J/cm(2) of energy density from a 5-ms pulse, which resulted in a resistivity of 2.4 x 10(-7)omega.m. After bending more than 1000 times, the resistivity of the light-sintered pattern was 1.45-times higher than that of the unbent pattern. The light-sintered pattern printed with the anti-oxidative copper nano-ink shows great promise for flexible device applications.en_US
dc.description.sponsorshipThis work was supported by the Human Resources Development program (No. 20174030201830) of the Korea Institute of Energy Technology Evaluation and Planning (KETEP) grant funded by the Korea government Ministry of Trade, Industry and Energy (No. 20154030200680). This work was also supported by a National Research Foundation (NRF) of Korea grant funded by the Korean government (MEST) (No. NPF-2015R1A2A1A13027910).en_US
dc.language.isoen_USen_US
dc.publisherELSEVIER SCIENCE SAen_US
dc.subjectCopper nanoparticlesen_US
dc.subjectAnti-oxidationen_US
dc.subjectInkjet printingen_US
dc.subjectFlexible filmen_US
dc.subjectFlash light sinteringen_US
dc.titleApplication of flash-light sintering method to flexible inkjet printing using anti-oxidant copper nanoparticlesen_US
dc.typeArticleen_US
dc.relation.volume656-
dc.identifier.doi10.1016/j.tsf.2018.04.034-
dc.relation.page61-67-
dc.relation.journalTHIN SOLID FILMS-
dc.contributor.googleauthorSon, Yeon-Ho-
dc.contributor.googleauthorJang, Joon-Young-
dc.contributor.googleauthorKang, Min Kyu-
dc.contributor.googleauthorAhn, Sunghoon-
dc.contributor.googleauthorLee, Caroline Sunyong-
dc.relation.code2018003110-
dc.sector.campusE-
dc.sector.daehakCOLLEGE OF ENGINEERING SCIENCES[E]-
dc.sector.departmentDEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING-
dc.identifier.pidsunyonglee-
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COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
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