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Effects of Interfacial Strength and Dimension of Structures on Physical Cleaning Window

Title
Effects of Interfacial Strength and Dimension of Structures on Physical Cleaning Window
Author
박진구
Keywords
Cleaning Process Window; Particle Removal; Pattern Collapse; Physical Cleaning
Issue Date
2012-04
Publisher
Solid State Phenomena
Citation
Diffusion and Defect Data-SSP, 2012, 187, P.123-126
Abstract
Four different types of FINs; amorphous Si (a-Si), annealed a-Si, polycrystalline Si (poly-Si) and crystalline Si (c-Si) were used to investigate the effect of interfacial strength and the length of structures on the physical cleaning window by measuring their collapse forces by atomic force microscope (AFM). A transmission electron microscope (TEM) and a nanoneedle with a nanomanipulator in a scanning electron microscope (SEM) were employed in order to explain the different collapse behavior and their forces. Different fracture shapes and collapse forces of FINs could explain the influence of the interfacial strength on the pattern strength. Furthermore, the different lengths of a-Si FINs were prepared and their collapse forces were measured and the shorter length reduced their pattern strength. Strong adhesion at the interface resulted in a wider process window while smaller dimensions made the process
URI
https://www.scientific.net/SSP.187.123http://repository.hanyang.ac.kr/handle/20.500.11754/70972
ISSN
1012-0394; 1662-9779
DOI
10.4028/www.scientific.net/SSP.187.123
Appears in Collections:
GRADUATE SCHOOL[S](대학원) > BIONANOTECHNOLOGY(바이오나노학과) > Articles
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