Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 박진구 | - |
dc.date.accessioned | 2018-04-23T02:22:00Z | - |
dc.date.available | 2018-04-23T02:22:00Z | - |
dc.date.issued | 2016-05 | - |
dc.identifier.issn | 0021-4922 | - |
dc.identifier.issn | 1347-4065 | - |
dc.identifier.uri | http://iopscience.iop.org/article/10.7567/JJAP.55.06JB01/meta | - |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/70314 | - |
dc.description.abstract | Benzotriazole (BTA) has been used to protect copper (Cu) from corrosion during Cu chemical mechanical planarization (CMP) processes. However, an undesirable Cu-BTA complex is deposited after Cu CMP processes and it should be completely removed at post-Cu CMP cleaning for next fabrication process. Therefore, it is very important to understand of Cu-BTA complex formation behavior for its applications such as Cu CMP and post-Cu CMP cleaning. The present study investigated the effect of pH and polisher conditions on the formation of Cu-BTA complex layers using electrochemical techniques (potentiodynamic polarization and electrochemical impedance spectroscopy) and the surface contact angle. The wettability was not a significant factor for the polishing interface, as no difference in the contact angles was observed for these processes. Both electrochemical techniques revealed that BTA had a unique advantage of long-term protection for Cu corrosion in an acidic condition (pH 3). (C) 2016 The Japan Society of Applied Physics | en_US |
dc.language.iso | en | en_US |
dc.publisher | IOP PUBLISHING LTD | en_US |
dc.subject | CORROSION-INHIBITORS | en_US |
dc.subject | CLEANING SOLUTION | en_US |
dc.subject | CU | en_US |
dc.subject | CMP | en_US |
dc.subject | SURFACE | en_US |
dc.subject | ALLOY | en_US |
dc.subject | IMPEDANCE | en_US |
dc.subject | FILMS | en_US |
dc.subject | ACID | en_US |
dc.subject | 1,2,3-BENZOTRIAZOLE | en_US |
dc.title | Effect of pH and chemical mechanical planarization process conditions on the copper-benzotriazole complex formation | en_US |
dc.title.alternative | JAPANESE JOURNAL OF APPLIED PHYSICS, v.55, no.6, page.1-5 | en_US |
dc.type | Article | en_US |
dc.relation.volume | 55 | - |
dc.identifier.doi | 10.7567/JJAP.55.06JB01 | - |
dc.relation.page | 1-6 | - |
dc.relation.journal | JAPANESE JOURNAL OF APPLIED PHYSICS | - |
dc.contributor.googleauthor | Cho, Byoung-Jun | - |
dc.contributor.googleauthor | Kim, Jin-Yong | - |
dc.contributor.googleauthor | Hamada, Satomi | - |
dc.contributor.googleauthor | Shima, Shohei | - |
dc.contributor.googleauthor | Park, Jin-Goo | - |
dc.relation.code | 2016000845 | - |
dc.sector.campus | S | - |
dc.sector.daehak | GRADUATE SCHOOL[S] | - |
dc.sector.department | DEPARTMENT OF BIONANOTECHNOLOGY | - |
dc.identifier.pid | jgpark | - |
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