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150oC 이하 저온에서의 미세 접합 기술

Title
150oC 이하 저온에서의 미세 접합 기술
Other Titles
Low Temperature bonding Technology for Electronic Packaging
Author
김영호
Keywords
Low temperature bonding; flip chip bonding
Issue Date
2012-03
Publisher
한국마이크로전자및패키징학회
Citation
한국마이크로전자 및 패키징학회지, Vol.19, No.1 [2012], p17 ~ 24
Abstract
Recently, flip chip interconnection has been increasingly used in microelectronic assemblies. The common Flip chip interconnection is formed by reflow of the solder bumps. Lead-Tin solders and Tin-based solders are most widely used for the solder bump materials. However, the flip chip interconnection using these solder materials cannot be applied to temperature-sensitive components since solder reflow is performed at relatively high temperature. Therefore the development of low temperature bonding technologies is required in these applications. A few bonding techniques at low temperature of 150oC or below have been reported. They include the reflow soldering using low melting point solder bumps, the transient liquid phase bonding by inter-diffusion between two solders, and the bonding using low temperature curable adhesive. This paper reviews various low temperature bonding methods.
URI
http://koreascience.or.kr/article/ArticleFullRecord.jsp?cn=MOKRBW_2012_v19n1_17http://hdl.handle.net/20.500.11754/67477
ISSN
1226-9360
DOI
10.6117/kmeps.2012.19.1.017
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MATERIALS SCIENCE AND ENGINEERING(신소재공학부) > Articles
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