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The Effect of Fillers in Nonconductive Adhesive on the Reliability of Chip-on-Glass Bonding with Sn/Cu Bumps

Title
The Effect of Fillers in Nonconductive Adhesive on the Reliability of Chip-on-Glass Bonding with Sn/Cu Bumps
Other Titles
Cu Bumps
Author
김영호
Keywords
tin/copper bump; nonconductive adhesive; chip-on-glass
Issue Date
2011-11
Publisher
Japan INST Metals
Citation
Materials Transactions, 2011, 52(11), P.2106-2110
Abstract
The effect of a nonconductive adhesive (NCA) on the reliability of chip-on-glass (COG) bonding was studied. Double layer bumps consisting of dome-shaped Sn on Cu columns were formed by electroplating and a reflow process, and were used for this study. COG bonding was performed between the reflowed Sn/Cu bumps on the oxidized Si wafer and an indium tin oxide/Au/Cu/Ti/glass substrate using a thermo-compression bonder. Three types of NCAs were applied during COG bonding: NCA-A with no fillers, NCA-B with fluoropolymer fillers, and NCA-C with silica fillers. Thermal cycling from -25 degrees C to 125 degrees C for 2000 cycles was performed to evaluate the effect of NCA type on the reliability of COG joints. The initial contact resistance values of the COG joints ranged from 32.2 m Omega to 39.3 m Omega. The contact resistance increased during the thermal cycling and the trend of contact resistance increment was different among three NCA types. The failure rate was the highest in NCA-C, followed by NCA-B and NCA-A in descending order. After the thermal cycling, the cross-sections of COG joints were observed with scanning electron microscopy to analyze the failure mechanism. The failures occurred primarily due to trapped fillers and NCAs at the interface between Sn/Cu bumps and the ITO substrate. [doi:10.2320/matertrans.M2011207]
URI
https://www.jstage.jst.go.jp/article/matertrans/52/11/52_M2011207/_article
ISSN
1345-9678; 1347-5320
DOI
10.2320/matertrans.M2011207
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MATERIALS SCIENCE AND ENGINEERING(신소재공학부) > Articles
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