2014-01 | Abrasive and additive interactions in high selectivity STI CMP slurries | 박진구 |
2013-01 | Acoustic cavitation behavior in isopropyl alcohol added cleaning solution | 박진구 |
2017-12 | Adhesion and removal behavior of particulate contaminants from EUV mask materials | 박진구 |
2017-08 | Adsorption of sodium dodecyl sulfate on cleaning of an N-polar GaN surface in an alkaline solution | 박진구 |
2015-01 | Characterization of Cu-BTA Organic Complexes on Cu during Cu CMP and Post Cu Cleaning | 박진구 |
2018-04 | Characterization of Free-Standing Nano-Membranes by Using Ellipsometry | 박진구 |
2014-06 | Characterization of non-amine-based post-copper chemical mechanical planarization cleaning solution | 박진구 |
2013-02 | Characterization of TMAH based cleaning solution for post Cu-CMP application | 박진구 |
2011-08 | Citric Acid and NaIO(4) Based Alkaline Cleaning Solution for Particle Removal during Post-Ru CMP Cleaning | 박진구 |
2012-03 | CMP defects | 박진구 |
2015-06 | Comparison between sapphire lapping processes using 2-body and 3-body modes as a function of diamond abrasive size | 박진구 |
2018-04 | Conductive and transparent submicron polymer lens array fabrication for electrowetting applications | 박진구 |
2017-09 | Critical dimension variation caused by wrinkle in extreme ultra-violet pellicle for 3-nm node | 박진구 |
2013-01 | Detection of Single Nucleotide Polymorphisms Using a Biosensor-Containing Titanium-Well Array | 박진구 |
2013-02 | Development of CO2 gas cluster cleaning method and its characterization | 박진구 |
2015-08 | Dimensionally controlled complex 3D sub-micron pattern fabrication by single step dual diffuser lithography (DDL) | 박진구 |
2011-10 | Effect of Acoustic Cavitation on Dissolved Gases and Their Characterization During Megasonic Cleaning | 박진구 |
2012-06 | Effect of Alkaline pH on Polishing and Etching of Single and Polycrystalline Silicon | 박진구 |
2014-02 | Effect of dissolved gases in water on acoustic cavitation and bubble growth rate in 0.83 MHz megasonic of interest to wafer cleaning | 박진구 |
2016-10 | Effect of Feature Spacing When Injection Molding Parts With Microstructured Surfaces | 박진구 |
2015-01 | Effect of FOUP atmosphere control on process wafer integrity in sub20nm device fabrication | 박진구 |
2014-05 | Effect of La doping of ceria abrasives for STI CMP | 박진구 |
2015-02 | Effect of lanthanum doping in ceria abrasives on chemical mechanical polishing selectivity for shallow trench isolation | 박진구 |
2018-10 | Effect of organic acids in dilute HF solutions on removal of metal contaminants on silicon wafer | 박진구 |
2015-10 | Effect of Particle Contamination on Extreme Ultraviolet (EUV) Mask and Megasonic Cleaning Process for Its Removal | 박진구 |
2016-05 | Effect of pH and chemical mechanical planarization process conditions on the copper-benzotriazole complex formation | 박진구 |
2011-10 | Effect of Pump Pulsation on Particle Contamination on Wafer Surface in Wet Cleaning System | 박진구 |
2011-01 | Effect of Rinse Process on Removal of Crown Type Defects during Photoresist Development | 박진구 |
2011-01 | Effect of Rinse Process on Removal of Crown Type Defects during Photoresist Development | 박진구 |
2014-01 | Effect of Silicon Dioxide Hardness on Scratches in Interlevel Dielectric Chemical-Mechanical Polishing | 박진구 |