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COLLEGE OF ENGINEERING[S](공과대학)
MATERIALS SCIENCE AND ENGINEERING(신소재공학부)
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Results 1-7 of 7 (Search time: 0.003 seconds).
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Issue Date
Title
Author(s)
2015-04
Current-assisted direct Cu/Cu joining
김영호
2015-07
Mechanical and electrical stability of PEDOT: PTS and Au source/drain electrodes for bottom contact OTFTs on plastic films under bending conditions
김영호
2015-05
Development of chip-on-flex bonding using Sn-based bumps and non-conductive adhesive
김영호
2015-05
Improved drop reliability of Sn-Ag-Cu solder joints by Zn addition to a Cu wetting layer
김영호
2015-09
The formation of Cu2O nanoparticles in polyimide using Cu electrodes via chemical curing, and their application in flexible polymer memory devices
김영호
2015-12
Low temperature chip on film bonding technology for 20 mu m pitch applications
김영호
2015-11
Improvement of the adhesion between polyaniline and commercial carbon paper by acid treatment and its application in supercapacitor electrodes
김영호
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ACFS
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acid treatment
1
Adhesion
1
AG3SN PLATE FORMATION
1
ALLOYS
1
ANISOTROPIC-CONDUCTIVE FILM
1
BUMPS
1
carbon paper
1
Chemical curing
1
CHIP SCALE PACKAGES
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