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Reliability of Cu to Cu joints fabricated using SnAg capping layer for 3D applications

Title
Reliability of Cu to Cu joints fabricated using SnAg capping layer for 3D applications
Author
김영호
Keywords
Daisy Chain; HTS; NCP; Reliability; T/C; TSV
Issue Date
2014-02
Publisher
Trans Tech Publications
Citation
Advanced Materials Research; February 2014, 900(1), P.711-714
Abstract
Chip to Chip bonding technology using Cu bumps with solder capping layer has been widely investigated for 3D chip stacking applications. We studied the reliability of the Cu joints. Cu bumps capped with Sn-Ag solder layer were joined to bare Cu pads or Au/Ni electroplated Cu pads at 300°C for 10 sec after dispensing non-conductive paste (NCP). After joining, there were no failed joints and the contact resistance of the joints was very low in all specimens. High temperature storage (HTS) test (120°C, up to 2000 hrs) results demonstrated that the reliability was good in all specimens, while thermal cycling test (-55°C /+125°C, up to 2500 cycles) results showed that the contact resistance of the joints increased quickly after 2000 cycles which was attributed the crack formation in the joint interfaces.
URI
https://www.scientific.net/AMR.900.711
ISSN
1022-6680
DOI
10.4028/www.scientific.net/AMR.900.711
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MATERIALS SCIENCE AND ENGINEERING(신소재공학부) > Articles
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