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미세금형 가공을 위한 전기화학식각 공정의 유한요소 해석 및 실험결과 비교

Title
미세금형 가공을 위한 전기화학식각 공정의 유한요소 해석 및 실험결과 비교
Author
박진구
Keywords
finite element simulation; electrochemical etching; TMEMM; metal mold
Issue Date
2012-08
Publisher
한국재료학회
Citation
한국재료학회지(Korean Journal of Materials Research), 2012, 22(9), P.482-488, 7P.
Abstract
To fabricate a precise micro metal mold, the electrochemical etching process has been researched. We investigated the electrochemical etching process numerically and experimentally to determine the etching tendency of the process, focusing on the current density, which is a major parameter of the process. The finite element method, a kind of numerical analysis, was used to determine the current density distribution on the workpiece. Stainless steel(SS304) substrate with various sized square and circular array patterns as an anode and copper(Cu) plate as a cathode were used for the electrochemical experiments. A mixture of H2SO4, H3PO4, and DIW was used as an electrolyte. In this paper, comparison of the results from the experiment and the numerical simulation is presented, including the current density distribution and line profile from the simulation, and the etching profile and surface morphology from the experiment. Etching profile and surface morphology were characterized using a 3D-profiler and FE-SEM measurement. From a comparison of the data, it was confirmed that the current density distribution and the line profile of the simulation were similar to the surface morphology and the etching profile of the experiment, respectively. The current density is more concentrated at the vertex of the square pattern and circumference of the circular pattern. And, the depth of the etched area is proportional to the current density.
URI
http://koreascience.or.kr/article/ArticleFullRecord.jsp?cn=GJRHBQ_2012_v22n9_482http://hdl.handle.net/20.500.11754/48292
ISSN
2287-7258; 1225-0562
DOI
10.3740/MRSK.2012.22.9.482
Appears in Collections:
GRADUATE SCHOOL[S](대학원) > BIONANOTECHNOLOGY(바이오나노학과) > Articles
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