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Removal of UV-cured resin using a hybrid cleaning process for nanoimprint lithography

Title
Removal of UV-cured resin using a hybrid cleaning process for nanoimprint lithography
Author
박진구
Keywords
UV-cured resin removal; UV/O3 pretreatment; DIO3 cleaning; Megasonic
Issue Date
2014-01
Publisher
Elsevier B.V
Citation
Microelectronic Engineering, February 2014, 114, 126-130
Abstract
Removal of resin residues from quartz surfaces is one of the most critical issues in ultraviolet (UV) nanoimprint lithography (NIL) processes. Traces of resin residues on a quartz stamp cause pattern defects in the subsequent UV NIL process. This study investigates the effect of UV/O3 pretreatment and ozone dissolved water (DIO3) cleaning with megasonic (MS) on UV-cured resin removal. The bulk resin was oxidized and removed partly by UV/O3 pretreatment. The resin residues which remained on the surface in the form of a thin layer were removed by cleaning with 40ppm DIO3 along with megasonic. Subsequently, cleaning was performed using a 10% KOH solution to remove the adhesion promoter. Contact angle measurements showed that the surface was hydrophilic in nature, which confirms the complete removal of the UV-cured resin and adhesion promoter from the SiO2 substrate.
URI
http://www.sciencedirect.com/science/article/pii/S0167931713004930?via%3Dihubhttp://hdl.handle.net/20.500.11754/47224
ISSN
0167-9317
DOI
10.1016/j.mee.2013.05.005
Appears in Collections:
GRADUATE SCHOOL[S](대학원) > BIONANOTECHNOLOGY(바이오나노학과) > Articles
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