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dc.contributor.author백운규-
dc.date.accessioned2018-03-15T05:07:43Z-
dc.date.available2018-03-15T05:07:43Z-
dc.date.issued2014-01-
dc.identifier.citationMicroelectronic Engineering, January 2014, 113, 50-54en_US
dc.identifier.issn0167-9317-
dc.identifier.urihttp://www.sciencedirect.com/science/article/pii/S0167931713005558?via%3Dihub-
dc.identifier.urihttp://hdl.handle.net/20.500.11754/47091-
dc.description.abstractWe investigated the effect of poly (ethyleneimine) (PEI)-modified silica abrasive on the removal rate and the degree of dishing during Cu chemical mechanical planarization (CMP). The PEI-modified silica abrasive was prepared by mutually attractive electrostatic forces between PEI and silica abrasive. The physico-chemical behaviors between PEI and the silica abrasive were evaluated by total organic carbon (TOC), force-separation measurements using atomic force microscopy (AFM) with molecular weight of PEI, which was found to adsorb on silica at pH 7.0 following a Langmuir isotherm. The maximum adsorbed amounts of low and high molecular weight PEI were 0.195mg/m2 and 0.228mg/m2, respectively. AFM results showed the repulsive force of the adsorbed PEI layers on the silica surface and the adsorption thickness of PEI on silica vary with the molecular weight of PEI. A twofold change was observed in the AFM analysis. First, the increased areal density of adsorbed PEI caused a higher zeta-potential and longer reaching repulsive force. Second, the adsorption thickness was also significantly enlarged. High molecular weight showed increased adsorption thickness under similar conditions compared to low molecular weight of PEI. These changes of silica abrasive such as electrostatic forces and steric interaction vary with molecular weight of PEI reduced the dishing of Cu pattern film from 50 to 20nm.en_US
dc.description.sponsorshipThis work was supported by the Global Research Laboratory (GRL) Program (K20704000003TA050000310) through the National Research Foundation of Korea (NRF) funded by the Ministry of Science, ICT (Information and Communication Technologies) and Future Planning, and the World Class University (WCU) Program (R31-10092) through the National Research Foundation of Korea (NRF) funded by the Ministry of Science, ICT (Information and Communication Technologies) and Future Planning.en_US
dc.language.isoenen_US
dc.publisherElsevier B.Ven_US
dc.subjectSilicaen_US
dc.subjectPEIen_US
dc.subjectChemical mechanical planarizationen_US
dc.subjectCopperen_US
dc.subjectDishingen_US
dc.subjectPhysico-chemical behavioren_US
dc.titleEffects of physico-chemical properties between poly(ethyleneimine) and silica abrasive on copper chemical mechanical planarizationen_US
dc.typeArticleen_US
dc.relation.volume113-
dc.identifier.doi10.1016/j.mee.2013.07.006-
dc.relation.page50-54-
dc.relation.journalMICROELECTRONIC ENGINEERING-
dc.contributor.googleauthorSeo, Jihoon-
dc.contributor.googleauthorYoon, Kwang Seob-
dc.contributor.googleauthorMoon, Jinok-
dc.contributor.googleauthorKim, Kijung-
dc.contributor.googleauthorSigmund, Wolfgang-
dc.contributor.googleauthorPaik, Ungyu-
dc.relation.code2014036027-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentDEPARTMENT OF ENERGY ENGINEERING-
dc.identifier.pidupaik-
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COLLEGE OF ENGINEERING[S](공과대학) > ENERGY ENGINEERING(에너지공학과) > Articles
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