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The effects of solder deformation on the wetting characteristics and interfacial reaction of Sn-3.5Ag solders on Cu substrates in fluxless soldering

Title
The effects of solder deformation on the wetting characteristics and interfacial reaction of Sn-3.5Ag solders on Cu substrates in fluxless soldering
Author
김영호
Keywords
REFLOW
Issue Date
2013-05
Publisher
Springer
Citation
Journal of Materials Science, Sep 2013, 24(9), P.3255-3261
Abstract
The effects of solder deformation on the wetting characteristics during fluxless soldering were studied when deformed Sn-3.5Ag solder balls were reacted with Cu or oxidized Cu substrates. The Cu surfaces were oxidized at 100 A degrees C for 2 or 4 h in air. After the 760 mu m diameter solder balls were deformed on the substrates under 0-30 N, they were then reflowed at 300 A degrees C for 30 s without flux. An optical microscope and a scanning electron microscope equipped with energy dispersive spectroscopy were used to measure the wetting angles and to characterize interfacial microstructures. As solder deformation increased, the wetting angle of solder bumps on the Cu or oxidized Cu substrates decreased and the spreading area increased. The oxide layer on the Cu surface decreased the wettability of the solders. Intermetallic compound (IMC) growth was suppressed in the solder interface when the solder reacted with oxidized Cu, while the IMC thickness increased with solder deformation. Solder deformation exposed a fresh Sn surface and improved contact between the solder and Cu substrate, thereby increasing the wettability of the solders.
URI
http://link.springer.com/article/10.1007%2Fs10854-013-1238-7http://hdl.handle.net/20.500.11754/45183
ISSN
0957-4522
DOI
10.1007/s10854-013-1238-7
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MATERIALS SCIENCE AND ENGINEERING(신소재공학부) > Articles
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