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Three-Side Buttable Integrated Ultrasound Chip With a 16 x 16 Reconfigurable Transceiver and Capacitive Micromachined Ultrasonic Transducer Array for 3-D Ultrasound Imaging Systems

Title
Three-Side Buttable Integrated Ultrasound Chip With a 16 x 16 Reconfigurable Transceiver and Capacitive Micromachined Ultrasonic Transducer Array for 3-D Ultrasound Imaging Systems
Author
권오경
Keywords
3-D ultrasound imaging system; capacitive micromachined ultrasonic transducer (CMUT); high-voltage pulse transmitter; reconfigurable array; three-side buttable; CIRCUIT; DESIGN
Issue Date
2013-10
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, NJ 08855-4141 USA
Citation
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2013, 60(10), P.3562-3569
Abstract
This paper presents an integrated ultrasound chip (IUC), which adopts a three-side buttable architecture to integrate a large number of capacitive micromachined ultrasonic transducers (CMUTs) and a reconfigurable 16 x 16 transceiver array to configure the transmitting and receiving patterns of a CMUT array. The IUC was fabricated using a silicon-based MEMS process and a 0.35-mu m CMOS process with 120 V devices. The transmitting and receiving patterns were controlled to optimize the image SNR and frame rate for a given target image. The proposed area-efficient high-voltage level shifter and digital pulse width control scheme were adopted to implement the reconfigurable transceiver array. Furthermore, a static sequential access memory block was implemented to reduce the loading time of the configuration data, which are used to control the IUC. For a 2 x 8 IUC array with a data rate of 400 Mb/s, the data-loading time was reduced from 123.2 to 1 mu s. The image of a spring with a diameter of 1 mm was successfully acquired using the proposed IUC with fully transmitting and receiving array.
URI
http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6587079&tag=1http://hdl.handle.net/20.500.11754/44543
ISSN
0018-9383
DOI
10.1109/TED.2013.2278441
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > ELECTRONIC ENGINEERING(융합전자공학부) > Articles
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