Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 김영호 | - |
dc.date.accessioned | 2018-03-09T06:58:54Z | - |
dc.date.available | 2018-03-09T06:58:54Z | - |
dc.date.issued | 2013-05 | - |
dc.identifier.citation | IEEE 63rd, 2013, P.755-760 | en_US |
dc.identifier.issn | 0569-5503 | - |
dc.identifier.uri | http://ieeexplore.ieee.org/document/6575657/ | - |
dc.identifier.uri | http://hdl.handle.net/20.500.11754/44344 | - |
dc.description.abstract | We successfully fabricated an eco-friendly Cu-Zn wetting layer for Sn-Ag-Cu (SAC) solders by electroplating in a cyanide-free solution. The reliabilities of solder joints formed on the Cu-Zn solder wetting layer were evaluated through the drop impact test and thermal cycling (T/C) test. First, board-level drop impact test was performed with the SAC solder joints formed on electroplated Cu or Cu-Zn layers. Drop test samples were fabricated by connecting SAC solders with Cu or Cu-20 wt% Zn wetting layer formed on printed circuit boards (PCBs). Cu-20 wt% Zn layers were electroplated in cyanide and cyanide-free solutions. Drop impact resistance of Cu-Zn/SAC/Cu-Zn solder joints was superior to that of Cu/SAC/Cu solder joints. Next, for T/C test, Cu pillar bumps with Sn-2.5 wt% Ag capping layers were fabricated on Si chip and joined with Cu or Cu-Zn layer on PCB substrate by flip chip bonding. T/C test was carried out between -55°C and 125°C up to 3000 cycles. The flip chip joints formed on either Cu or Cu-Zn layer showed excellent T/C reliability in the underfilled condition. The failure was not observed in both samples after 3000 cycles. When underfill was not applied in the flip chip joints, Cu-Zn samples exhibited better results than Cu samples even though both samples had short thermal fatigue life. The improvement of reliability in Cu-Zn samples was ascribed to the beneficial effect of Zn. Our results implied that electroplating of Cu-Zn layers in a cyanide-free solution was successful and the reliability of solder joints can be enhanced by applying a Cu-Zn solder wetting layer. | en_US |
dc.language.iso | en | en_US |
dc.publisher | IEEE | en_US |
dc.subject | Components, Circuits, Devices and Systems | en_US |
dc.subject | Engineered Materials, Dielectrics and Plasmas | en_US |
dc.subject | Fields, Waves and Electromagnetics | en_US |
dc.subject | Soldering | en_US |
dc.subject | Reliability | en_US |
dc.subject | Zinc | en_US |
dc.subject | Substrates | en_US |
dc.subject | Fatigue | en_US |
dc.subject | Silicon | en_US |
dc.subject | Resistance | en_US |
dc.title | An Eco-friendly Cu-Zn Wetting Layer for Highly Reliable Solder Joints | en_US |
dc.type | Article | en_US |
dc.relation.volume | 63 | - |
dc.identifier.doi | 10.1109/ECTC.2013.6575657 | - |
dc.relation.page | 755-760 | - |
dc.contributor.googleauthor | Kim, Young Min | - |
dc.contributor.googleauthor | Kim, Sun-Chul | - |
dc.contributor.googleauthor | Kim, Young-Ho | - |
dc.sector.campus | S | - |
dc.sector.daehak | COLLEGE OF ENGINEERING[S] | - |
dc.sector.department | DIVISION OF MATERIALS SCIENCE AND ENGINEERING | - |
dc.identifier.pid | kimyh | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.