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dc.contributor.author김영호-
dc.date.accessioned2018-02-06T07:32:58Z-
dc.date.available2018-02-06T07:32:58Z-
dc.date.issued2016-03-
dc.identifier.citationJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v. 27, NO 7, Page. 6646-6655en_US
dc.identifier.issn0957-4522-
dc.identifier.issn1573-482X-
dc.identifier.urihttps://link.springer.com/article/10.1007%2Fs10854-016-4611-5-
dc.identifier.urihttp://hdl.handle.net/20.500.11754/35682-
dc.description.abstractFlip-chip bonding using a nonconductive adhesive (NCA) and the effect of solder wetting on NCA trapping were studied. Three different solder materials with different melting point were used for the bonding process: In-48Sn, Bi-42Sn, and Sn-3.5Ag. Additionally, the bonding process was performed at various temperatures. We measured the amount of NCA trapping as functions of the solder material and bonding temperature. The fillers and NCA were easily trapped between the solder and Cu pads. The amount of trapped fillers and NCA increased with softer solder materials. These trapped fillers and NCA could be reduced if the solder melted and reacted to Cu pads during the bonding process. However, if the solder melted after fully curing NCA, the trapped NCA was not reduced due to the low mobility of cured NCA. Therefore, in order to reduce NCA trapping, the solder should be melted before curing NCA. The electrical test results showed that the contact resistance increased with increasing amount of trapped fillers and NCA.en_US
dc.description.sponsorshipThis work was financially supported through a Grant (10051605) from the Ministry of Trade, Industry & Energy, Republic of Korea.en_US
dc.language.isoenen_US
dc.publisherSPRINGERen_US
dc.subjectANISOTROPIC CONDUCTIVE FILMen_US
dc.subjectCONTACT RESISTANCEen_US
dc.subjectBUMPSen_US
dc.subjectPACKAGESen_US
dc.subjectSNen_US
dc.subjectRELIABILITYen_US
dc.subjectSTRENGTHen_US
dc.subjectACFen_US
dc.titleThe effect of solder wetting on nonconductive adhesive (NCA) trapping in NCA applied flip-chip bondingen_US
dc.typeArticleen_US
dc.relation.no7-
dc.relation.volume27-
dc.identifier.doi10.1007/s10854-016-4611-5-
dc.relation.page6646-6655-
dc.relation.journalJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS-
dc.contributor.googleauthorKim, Sun-Chul-
dc.contributor.googleauthorLee, Ja Yeon-
dc.contributor.googleauthorPark, Jae-Yong-
dc.contributor.googleauthorLee, Tae-Young-
dc.contributor.googleauthorKim, Young-Ho-
dc.relation.code2016001662-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentDIVISION OF MATERIALS SCIENCE AND ENGINEERING-
dc.identifier.pidkimyh-
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MATERIALS SCIENCE AND ENGINEERING(신소재공학부) > Articles
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