85 0

Full metadata record

DC FieldValueLanguage
dc.contributor.author김영호-
dc.date.accessioned2018-02-05T01:14:43Z-
dc.date.available2018-02-05T01:14:43Z-
dc.date.issued2016-03-
dc.identifier.citationJOURNAL OF THE ELECTROCHEMICAL SOCIETY, v. 163, NO 6, Page. 250-255en_US
dc.identifier.issn0013-4651-
dc.identifier.issn1945-7111-
dc.identifier.urihttp://jes.ecsdl.org/content/163/6/D250-
dc.identifier.urihttp://hdl.handle.net/20.500.11754/35368-
dc.description.abstractWe investigated the effects of bath composition on the adhesion characteristics of electroless Cu on epoxy-based polymer substrates. The Cu layer was electroless-plated on the epoxy-based polymer substrate via four electroless-plating baths. A Cu layer was electroplated, which was then cured at 150 degrees C for 1 h. The adhesion was evaluated using a 90 degrees peel test. The size of the nodules and grains found in the electroless Cu layers decreased with increasing electrolyte concentration in the plating bath, resulting in increased hardness. At the highest electrolyte concentration, the electroless Cu layer exhibited high porosity in conjunction with the least coverage. The porosity of the electroless Cu layer decreased and the coverage improved with decreasing electrolyte concentration; however, a non-uniform layer formed at the lowest electrolyte concentration. The peel strength increased initially with the bath concentration, and then decreased upon further increase in bath concentration. The variation of the peel strength was related to the coverage and the hardness of the electroless Cu layer. We utilized a two-step electroless-plating method (the first layer with better coverage and second layer with larger ductility). The peel strength of the optimized double-layered electroless Cu layer was higher than that of the single-layered electroless Cu layer. (C) 2016 The Electrochemical Society. All rights reserved.en_US
dc.description.sponsorshipThis research was financially supported by Daeduck Electronics co. Ltd.en_US
dc.language.isoenen_US
dc.publisherELECTROCHEMICAL SOC INCen_US
dc.subjectCOPPER DEPOSITIONen_US
dc.subjectBARRIER LAYERSen_US
dc.subjectSEED LAYERen_US
dc.subjectPERFORMANCEen_US
dc.subjectSTRENGTHen_US
dc.subjectNUCLEATIONen_US
dc.subjectFILMen_US
dc.titleEffects of Bath Composition on the Adhesion Characteristics of Electroless Cu Layers on Epoxy-Based Polymer Substratesen_US
dc.typeArticleen_US
dc.relation.no6-
dc.relation.volume163-
dc.identifier.doi10.1149/2.0721606jes-
dc.relation.page250-255-
dc.relation.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETY-
dc.contributor.googleauthorSeong, Haseob-
dc.contributor.googleauthorKim, Sun-Chul-
dc.contributor.googleauthorChoi, Dong Joo-
dc.contributor.googleauthorLee, Ja-Yeon-
dc.contributor.googleauthorKo, Young-Joo-
dc.contributor.googleauthorYoon, Suk-beom-
dc.contributor.googleauthorSeo, Mi-lim-
dc.contributor.googleauthorKim, Young-ho-
dc.relation.code2016002465-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentDIVISION OF MATERIALS SCIENCE AND ENGINEERING-
dc.identifier.pidkimyh-
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MATERIALS SCIENCE AND ENGINEERING(신소재공학부) > Articles
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML


qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE