63 0

Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn/Cu bumps and non-conductive adhesives

Title
Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn/Cu bumps and non-conductive adhesives
Other Titles
Cu bumps and non-conductive adhesives
Author
김영호
Keywords
FLIP-CHIP; BONDING PRESSURE; INTERCONNECTION; RELIABILITY; TEMPERATURE; PERFORMANCE; ASSEMBLIES; LCDS
Issue Date
2011-04
Publisher
PERGAMON-ELSEVIER SCIENCE LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD OX5 1GB, ENGLAND
Citation
MICROELECTRONICS RELIABILITY, v. 51, NO 4, Page. 851-859
Abstract
We have developed a reliable and ultra-fine pitch chip on glass (COG) bonding technique using Sn/Cu bumps and non-conductive adhesive (NCA). Sn/Cu bumps were formed by electroplating and reflowed, forming dome shaped Sn bumps on Cu columns. COG bonding was performed between the reflowed Sn/Cu bumps on the oxidized Si wafer and ITO/Au/Cu/Ti/glass substrate using a thermo-compression bonder. Three different NCAs were applied during bonding. Bonding temperature was 150 degrees C for NCA-A and NCA-B, and 110 degrees C for NCA-C. The electrical properties of COG joints were evaluated by measuring the contact resistance of each joint through the four-point probe method. All joints were successfully bonded and the electrical measurement showed that the average contact resistance of each joint was approximately 30 m Omega, regardless of NCA types. The COG joints were subjected to a series of reliability tests: high temperature storage test (85 degrees C, 160 h); thermal cycling test (-40 degrees C/+85 degrees C, 20 cycle); and a temperature and humidity test (50 degrees C/90%, 160 h) were sequentially performed to evaluate the reliability of the COG joints. The contact resistance measurement showed that there were no failed bumps in all specimens and all joints passed the criterion after reliability test. (C) 2010 Elsevier Ltd. All rights reserved.
URI
http://www.sciencedirect.com/science/article/pii/S0026271410005469?via%3Dihubhttp://hdl.handle.net/20.500.11754/35023
ISSN
0026-2714; 0026-2714
DOI
10.1016/j.microrel.2010.11.003
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MATERIALS SCIENCE AND ENGINEERING(신소재공학부) > Articles
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML


qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE