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Thin film encapsulation for flexible AM-OLED: a review

Title
Thin film encapsulation for flexible AM-OLED: a review
Author
박진성
Keywords
ATOMIC LAYER DEPOSITION; LIGHT-EMITTING DEVICES; GAS-DIFFUSION BARRIERS; SURFACE-CHEMISTRY; VAPOR-DEPOSITION; POLYMERS; PERMEATION; COATINGS; DIODES; OXYGEN
Issue Date
2011-02
Publisher
IOP PUBLISHING LTD
Citation
SEMICONDUCTOR SCIENCE AND TECHNOLOGY, v. 26, NO 3, Page. 1-1
Abstract
Flexible organic light emitting diode (OLED) will be the ultimate display technology to customers and industries in the near future but the challenges are still being unveiled one by one. Thin-film encapsulation (TFE) technology is the most demanding requirement to prevent water and oxygen permeation into flexible OLED devices. As a polymer substrate does not offer the same barrier performance as glass, the TFE should be developed on both the bottom and top side of the device layers for sufficient lifetimes. This work provides a review of promising thin-film barrier technologies as well as the basic gas diffusion background. Topics include the significance of the device structure, permeation rate measurement, proposed permeation mechanism, and thin-film deposition technologies (Vitex system and atomic layer deposition (ALD)/molecular layer deposition (MLD)) for effective barrier films.
URI
http://www.ndsl.kr/ndsl/search/detail/article/articleSearchResultDetail.do?cn=NART55432174http://iopscience.iop.org/article/10.1088/0268-1242/26/3/034001/meta
ISSN
0268-1242
DOI
10.1088/0268-1242/26/3/034001
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MATERIALS SCIENCE AND ENGINEERING(신소재공학부) > Articles
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