| 2021 | Computationaldesigntoimprovepolymerelectrolytefuelcellperformancebyflowfieldmodification | 손종현 |
| 2023 | 전자기기의효과적인열관리를위한투명복사냉각메타물질제작 | 이강원 |
| 2021 | Wavepropagationanalysisontherailwaytrackwithperiodicallyattachedtunedparticleimpactdampersforrollingnoisereduction | 김걸 |
| 2023 | 딥드로잉 공정중 실시간 모니터링 신호의 recurrence quantification analysis을 이용한 적응형 성형 품질 제어 방벙론 | 장인제 |
| 2023 | Visual Simulation of Ultraviolet Dose on Human Skin with Sunscreen Applied Using Minimal Erythema Dose | 이지 |
| 2023 | A Study on the development of filter media and antibacterial filter to improve air cleaning system performance | 이경환 |
| 2023 | Virtual Intraoral Scanner for Error Analysis and Dynamically Weighted One-Point Bidirectional Path Search Based on Feature Extraction for Margin Lines | 신형섭 |
| 2023 | CFD Modeling for Ammonia-Diesel Dual-Fuel Combustion in Heavy-Duty Engines | 신지수 |
| 2022 | Ultrasonic Nondestructive Testing for Metal Additive Manufacturing: Microstructural Characterization, Online Monitoring, and Deep Learning Application | 박성현 |
| 2023 | Effect of Laminar, Turbulent, and Slip Conditions of the Fluid Film on Dry Gas Seal | 한미쁨 |
| 2023 | 구조 진동 분석 및 딥러닝 기법을 이용한 공작기계 상태 모니터링 | 정광훈 |
| 2023 | Thermal behavior estimation during thermal sintering of inkjet-printed silver nanoparticles via modulated laser beam and electrical sintering | 아리프후사인 |
| 2023 | Mathematical modeling and optimization in tandem gas metal arc welding with an opposite-polarity electrode | 김진영 |
| 2023 | 운전 중 진동응답을 이용한 곡관 두께 추정용 딥러닝 모델 개발 | 김종환 |
| 2023 | 분무유도방식 가솔린 직접 분사가 적용된 가시화 엔진의 실린더 내부 유동 특성 | 김동환 |
| 2023 | 가솔린 엔진 크랭크 트레인의 마찰손실 저감에 관한 연구 | 강종대 |
| 2022 | Design and Manufacturing of Electrically Driven Soft Actuators and Robots based on Liquid-Vapor Phase Transition | Beomchan Kang |
| 2022 | Prediction of mechanical behavior of composite structures by deep learning technologies | Dug-Joong KIM |
| 2022 | Study on Hetero-integration of Nano/micro-scale Semiconducting Materials onto Foreign Substrates for Effective Light Energy Conversion | Youngshik Cho |
| 2022 | A study on the durability analysis for semiconductor package interconnects subject to thermal cycle test | Yong-Rae JANG |
