Effects of UV curing on the self-forming barrier process of Cu-V alloy films

Title
Effects of UV curing on the self-forming barrier process of Cu-V alloy films
Authors
박종완
Keywords
Copper diffusion barrier; Self-forming barrier; Low-k; UV curing
Issue Date
2015-08
Publisher
ELSEVIER SCIENCE SA
Citation
SURFACE & COATINGS TECHNOLOGY, v. 276, Page. 254-259
Abstract
In our previous studies, vanadium (V)-based self-formed barriers were found at the interface between Cu-V alloy films and low-k/Si substrates after annealing at elevated temperatures. In the present work, the diffusion barrier properties of the V-based self-formed interlayer on low-k dielectrics were investigated with and without UV curing treatment. A V-based interlayer on a low-k substrate with UV curing exhibited lower electrical resistivity and higher thermal stability than on a low-k substrate without UV curing. Transmission electron microscopy (TEM) images and energy-dispersive X-ray spectroscopy (EDS) showed that an approximately 4-nm V-based interlayer was found only on the low-k substrates with UV curing after annealing at 300 degrees C for 1 h. Based on these results, UV curing may play an important role in the formation of a V-based interlayer due to changes in the chemical composition and porosity of the dielectric layer. (C) 2015 Elsevier B.V. All rights reserved.
URI
http://www.sciencedirect.com/science/article/pii/S0257897215300839http://hdl.handle.net/20.500.11754/26799
ISSN
0257-8972
DOI
http://dx.doi.org/10.1016/j.surfcoat.2015.06.049
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MATERIALS SCIENCE AND ENGINEERING(신소재공학부) > Articles
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML


qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE