Interpolymer complexes of poly(acrylic acid) and poly(ethylene glycol) for low dishing in STI CMP
- Title
- Interpolymer complexes of poly(acrylic acid) and poly(ethylene glycol) for low dishing in STI CMP
- Author
- 백운규
- Keywords
- Passivation agent; PAA; PEG; Interpolymer complexes; Dishing; CMP
- Issue Date
- 2015-06
- Publisher
- ELSEVIER SCIENCE BV
- Citation
- APPLIED SURFACE SCIENCE, v. 353, Page. 499-503
- Abstract
- Although poly(acrylic acid) (PAA) has been used as a passivation agent for high polish rate selectivity between SiO2 and Si3N4 in STI CMP, it causes severe dishing during the over-polishing step. Here, we fabricated interpolymer complexes of PAA and poly(ethylene glycol) (PEG) as passivation agent for low dishing as well as high selectivity. PAA and PEG form a cross-linked network structure through H-bonding, which is called an "interpolymer complex". During the over-polishing step, the cross-linked network structure of the PAA-PEG interpolymer complex prevents abrasives from polishing SiO2 in the trenches, resulting in a significant decrease in dishing. These results provide researchers with a new approach toward passivation agents to provide low dishing in STI CMP. (C) 2015 Elsevier B.V. All rights reserved.
- URI
- http://www.sciencedirect.com/science/article/pii/S0169433215014221http://hdl.handle.net/20.500.11754/25460
- ISSN
- 0169-4332; 1873-5584
- DOI
- 10.1016/j.apsusc.2015.06.078
- Appears in Collections:
- COLLEGE OF ENGINEERING[S](공과대학) > ENERGY ENGINEERING(에너지공학과) > Articles
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