Interpolymer complexes of poly(acrylic acid) and poly(ethylene glycol) for low dishing in STI CMP

Title
Interpolymer complexes of poly(acrylic acid) and poly(ethylene glycol) for low dishing in STI CMP
Authors
백운규
Keywords
Passivation agent; PAA; PEG; Interpolymer complexes; Dishing; CMP
Issue Date
2015-06
Publisher
ELSEVIER SCIENCE BV
Citation
APPLIED SURFACE SCIENCE, v. 353, Page. 499-503
Abstract
Although poly(acrylic acid) (PAA) has been used as a passivation agent for high polish rate selectivity between SiO2 and Si3N4 in STI CMP, it causes severe dishing during the over-polishing step. Here, we fabricated interpolymer complexes of PAA and poly(ethylene glycol) (PEG) as passivation agent for low dishing as well as high selectivity. PAA and PEG form a cross-linked network structure through H-bonding, which is called an "interpolymer complex". During the over-polishing step, the cross-linked network structure of the PAA-PEG interpolymer complex prevents abrasives from polishing SiO2 in the trenches, resulting in a significant decrease in dishing. These results provide researchers with a new approach toward passivation agents to provide low dishing in STI CMP. (C) 2015 Elsevier B.V. All rights reserved.
URI
http://www.sciencedirect.com/science/article/pii/S0169433215014221http://hdl.handle.net/20.500.11754/25460
ISSN
0169-4332; 1873-5584
DOI
http://dx.doi.org/10.1016/j.apsusc.2015.06.078
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > ENERGY ENGINEERING(에너지공학과) > Articles
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