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|dc.identifier.citation||MICROELECTRONICS RELIABILITY, v. 55, NO 8, Page. 1241-1247||en_US|
|dc.description.abstract||We developed a reliable and low cost chip-on-flex (COF) bonding technique using Sn-based bumps and a non-conductive adhesive (NCA). Two types of bump materials were used for the bonding process: Sn bumps and Sn-Ag bumps. The bonding process was performed at 180 degrees C for 10 s using a thermo-compression bonder after dispensing the NCA. Sn-based bumps were easily deformed to contact Cu pads during the bonding process. A thin layer of Cu6Sn5 intermetallic compound was observed at the interface between Sn-based bumps and Cu pads. After bonding, electrical measurements showed that all COF joints had very low contact resistance, and there were no failed joints. To evaluate the reliability of COF joints, high temperature storage tests (150 degrees C, 1000 h), thermal cycling tests (-25 degrees C/+125 degrees C, 1000 cycles) and temperature and humidity tests (85 degrees C/85% RH, 1000 h) were performed. Although contact resistance was slightly increased after the reliability test, all COF joints passed failure criteria. Therefore, the metallurgical bond resulted in good contact and improved the reliability of the joints. (C) 2015 Elsevier Ltd. All rights reserved.||en_US|
|dc.publisher||PERGAMON-ELSEVIER SCIENCE LTD||en_US|
|dc.title||Development of chip-on-flex bonding using Sn-based bumps and non-conductive adhesive||en_US|
|dc.sector.daehak||COLLEGE OF ENGINEERING[S]||-|
|dc.sector.department||DIVISION OF MATERIALS SCIENCE AND ENGINEERING||-|
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