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테라헤르츠파 비파괴검사법을 이용한 반도체 패키징 내부 공동 검출에 관한 연구

Title
테라헤르츠파 비파괴검사법을 이용한 반도체 패키징 내부 공동 검출에 관한 연구
Other Titles
The detection of the voids in semiconductor packages using non-destructive evaluation of THz-TDS
Author
김학성
Issue Date
2015-04
Publisher
대한기계학회
Citation
재료 및 파괴부문 춘계학술대회 논문집 , 2015.4, 265-266
URI
http://www.dbpia.co.kr/Article/NODE06269276http://hdl.handle.net/20.500.11754/24304
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MECHANICAL ENGINEERING(기계공학부) > Articles
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