A Highly Reliable Copper Nanowire/Nanoparticle Ink Pattern with High Conductivity on Flexible Substrate Prepared via a Flash Light-Sintering Technique

Title
A Highly Reliable Copper Nanowire/Nanoparticle Ink Pattern with High Conductivity on Flexible Substrate Prepared via a Flash Light-Sintering Technique
Author
김학성
Keywords
flash light sintering copper nanoparticles; copper nanowires; printed' electronics; reliability of electrode
Issue Date
2015-04
Publisher
AMER CHEMICAL SOC
Citation
ACS APPLIED MATERIALS & INTERFACES, v. 7, NO 10, Page. 5674-5684
Abstract
In this work, copper nanowires (NWs) and Cu nanoparticles (NPs) were employed to increase the reliability of a printed electrode pattern under mechanical bending fatigue. The fabricated Cu NW/NP inks with different weight fractions of Cu NWs were printed on a polyimide substrate and flash light-sintered within a few milliseconds at room temperature under ambient conditions. Then, 1000 cycles of outer and inner bending fatigue tests were performed using a lab-made fatigue tester. The flash light-sintered Cu NW/NP ink film with 5 wt % Cu NWs prepared under the flash light-sintering conditions (12.5 J center dot cm(2) irradiation energy, 10 ms pulse duration, and one pulse) showed a lower resistivity (22.77 mu O center dot cm) than those of the only Cu NPs and Cu NWs ink (94.01 mu O center dot cm and 104.15 mu O center dot cm, respectively). In addition, the resistance change (Delta R center dot R01) of the 5 wt % Cu NWs Cu NW/NP film was greatly enhanced to 4.19 compared to the 92.75 of the Cu NPs film obtained under mechanical fatigue conditions over 1000 cycles and an outer bending radius of 7 mm. These results were obtained by the densification and enhanced mechanical flexibility of flash light-sintered Cu NW/NP network, which resulted in prevention of crack initiation and propagation. To characterize the Cu NW/NP ink film, X-ray diffraction and scanning electron microscopy were used.
URI
http://pubs.acs.org/doi/abs/10.1021/am506765phttp://hdl.handle.net/20.500.11754/24137
ISSN
1944-8244; 1944-8252
DOI
10.1021/am506765p
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MECHANICAL ENGINEERING(기계공학부) > Articles
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML


qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE