Current-assisted direct Cu/Cu joining

Title
Current-assisted direct Cu/Cu joining
Author
김영호
Keywords
Joining; Electromigration; Joule heating; Cu/Cu direct
Issue Date
2015-04
Publisher
PERGAMON-ELSEVIER SCIENCE LTD
Citation
SCRIPTA MATERIALIA, v. 104, Page. 21-24
Abstract
Enhanced direct Cu/Cu joining by applying current was investigated. Joining was conducted at 240-300 degrees C for 10-50 min under 40 MPa. Current was applied to Cu wire during joining. Contact resistance of joints decreased and the fracture load of joints increased as the current increased. The joined region increased and the interface became less straight as the current increased. These results are ascribed to electromigration and joule heating effects. The enhanced diffusion contributed significantly to the joining of metals. (C) 2015 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
URI
http://www.sciencedirect.com/science/article/pii/S1359646215001220http://hdl.handle.net/20.500.11754/23972
ISSN
1359-6462
DOI
10.1016/j.scriptamat.2015.03.016
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MATERIALS SCIENCE AND ENGINEERING(신소재공학부) > Articles
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