Flash light sintered copper precursor/nanoparticle pattern with high electrical conductivity and low porosity for printed

Title
Flash light sintered copper precursor/nanoparticle pattern with high electrical conductivity and low porosity for printed
Author
김학성
Keywords
Copper nanoparticles; Precursor solution; Flash light sintering; Low porosity; Printed electronics
Issue Date
2015-03
Publisher
ELSEVIER SCIENCE SA
Citation
THIN SOLID FILMS, v. 580, Page. 61-70
Abstract
In this work, the hybrid copper inks with precursor and nanoparticles were fabricated and sintered via flash light irradiation to achieve highly conductive electrode pattern with low porosity. The hybrid copper ink was made of copper nanoparticles and various copper precursors (e.g., copper(II) chloride, copper(II) nitrate trihydrate, copper(II) sulfate pentahydrate and copper(II) trifluoroacetylacetonate). The printed hybrid copper inks were sintered at room temperature and under ambient conditions using an in-house flash light sintering system. The effects of copper precursor weight fraction and the flash light irradiation conditions (light energy and pulse duration) were investigated. Surfaces of the sintered hybrid copper patterns were analyzed using a scanning electron microscope. Also, spectroscopic characterization techniques such as Fourier transform infrared spectroscopy and X-ray diffraction were used to investigate the crystal phases of the flash light sintered copper precursors. High conductivity hybrid copper patterns (27.3 mu Omega cm), which is comparable to the resistivity of bulk copper (1.68 mu Omega cm) were obtained through flash light sintering at room temperature and under ambient conditions. (C) 2015 Elsevier B.V. All rights reserved.
URI
http://www.sciencedirect.com/science/article/pii/S0040609015002096http://hdl.handle.net/20.500.11754/22631
ISSN
0040-6090
DOI
10.1016/j.tsf.2015.03.004
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MECHANICAL ENGINEERING(기계공학부) > Articles
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