Influence of bacterial adhesion on copper extraction from printed circuit boards

Title
Influence of bacterial adhesion on copper extraction from printed circuit boards
Authors
박재구
Keywords
Printed circuit boards; Bioleaching; Copper extraction; Bacterial adhesion
Issue Date
2015-02
Publisher
ELSEVIER SCIENCE BV
Citation
SEPARATION AND PURIFICATION TECHNOLOGY, v. 143, Page. 169-176
Abstract
In order to analyze the influence of the contact mechanism in the bioleaching process, bacterial attachment on the Printed Circuit Boards (PCB) surface was avoided using a partition system. The partition system was obtained with a semi-permeable membrane of 12-14 kDa MWCO. A PCB sample of 500-1000 mu m particle size was placed inside a partition system for 144 h to compare the copper (Cu) extraction rate by Acidithiobacillus ferrooxidans, with the Cu extraction of a system without partition. The results demonstrated that when the contact mechanism was avoided, there was a decrease of 25% in the Cu extraction. When the contact bioleaching was enabled, 1.46 g of Cu was extracted from the initial 1.61 g of Cu (similar to 91% extraction). When the partition system was used, only 1.10 g of Cu was extracted (similar to 68% extraction). Bacterial adhesion experiments proved that within the first hour of the experiment, 4.30 x 10(7) cells were attached per gram of PCB, supporting that bacterial adhesion was responsible for the higher Cu extraction rate. The results for bacterial adhesion tests were consistent with Derjaguin-Landau-Verwey-Overbeek theory. (C) 2015 Elsevier B.V. All rights reserved.
URI
http://www.sciencedirect.com/science/article/pii/S1383586615000672http://hdl.handle.net/20.500.11754/22309
ISSN
1383-5866; 1873-3794
DOI
http://dx.doi.org/10.1016/j.seppur.2015.01.038
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > EARTH RESOURCES AND ENVIRONMENTAL ENGINEERING(자원환경공학과) > Articles
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