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Effect of Ni-P Plating Temperature on Growth of Interfacial Intermetallic Compound in Electroless Nickel Immersion Gold/Sn-Ag-Cu Solder Joints

Title
Effect of Ni-P Plating Temperature on Growth of Interfacial Intermetallic Compound in Electroless Nickel Immersion Gold/Sn-Ag-Cu Solder Joints
Author
김영호
Keywords
Electroless nickel immersion gold; Sn-3.0Ag-0.5Cu; Ni-P; plating temperature; interfacial intermetallic compound; brittle fracture; high-speed shear strength
Issue Date
2018-01
Publisher
SPRINGER
Citation
JOURNAL OF ELECTRONIC MATERIALS, v. 47, no. 1, page. 110-116
Abstract
The growth of interfacial intermetallic compound and the brittle fracture behavior of Sn-3.0Ag-0.5-Cu solder (SAC305) joints on electroless nickel immersion gold (ENIG) surface finish have been investigated using Ni-P plating solution at temperatures from 75A degrees C to 85A degrees C and fixed pH of 4.5. SAC305 solder balls with diameter of 450 mu m were mounted on the prepared ENIG-finished Cu pads and reflowed with peak temperature of 250A degrees C. The interfacial intermetallic compound (IMC) thickness after reflow decreased with increasing Ni-P plating temperature. After 800 h of thermal aging, the IMC thickness of the sample prepared at 85A degrees C was higher than for that prepared at 75A degrees C. Scanning electron microscopy of the Ni-P surface after removal of the Au layer revealed a nodular structure on the Ni-P surface. The nodule size of the Ni-P decreased with increasing Ni-P plating temperature. The Cu content near the IMC layer increased to 0.6 wt.%, higher than the original Cu content of 0.5 wt.%, indicating that Cu diffused from the Cu pad to the solder ball through the Ni-P layer at a rate depending on the nodule size. The sample prepared at 75A degrees C with thicker interfacial IMC showed greater high-speed shear strength than the sample prepared at 85A degrees C. Brittle fracture increased with decreasing Ni-P plating temperature.
URI
https://link.springer.com/article/10.1007%2Fs11664-017-5821-1http://repository.hanyang.ac.kr/handle/20.500.11754/117139
ISSN
0361-5235; 1543-186X
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MATERIALS SCIENCE AND ENGINEERING(신소재공학부) > Articles
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