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dc.contributor.author김영호-
dc.date.accessioned2019-12-03T01:35:49Z-
dc.date.available2019-12-03T01:35:49Z-
dc.date.issued2017-12-
dc.identifier.citationJOURNAL OF ELECTRONIC PACKAGING, v. 139, no. 4, Article no. 041004en_US
dc.identifier.issn1043-7398-
dc.identifier.issn1528-9044-
dc.identifier.urihttp://electronicpackaging.asmedigitalcollection.asme.org/article.aspx?articleid=2647595-
dc.identifier.urihttp://repository.hanyang.ac.kr/handle/20.500.11754/116653-
dc.description.abstractThe effect of applied current in enhancing bonding was studied in Cu-to-Cu direct bonding using Cu microbumps. A daisy-chain structure of electroplated Cu microbumps (20 mu m x 20 mu m) was fabricated on Si wafer. Cu-to-Cu bonding was performed in ambient atmosphere at 200-300 degrees C for 10 min under 260 MPa, during which direct current of 0-10 A (2.5 x 10(6) A/cm(2)) was applied. With increasing applied current, the contact resistance decreased and the shear strength in the Cu-to-Cu joints increased. The enhanced bonding imparted by the application of current was ascribed to Joule heating and electromigration effects. Subsequently, the joint temperature was calibrated to isolate the electromigration effects for study. In Cu-to-Cu joints joined at the same adjusted temperature, increasing the current caused unbonded regions to decrease and regions of cohesive failure to increase. The enhanced diffusion across the Cu/Cu interfaces under the applied current was the main mechanism whereby the quality of the Cu-to-Cu joints was improved.en_US
dc.description.sponsorshipSK Hynix, Inc. (Grant No. 201400000000777).en_US
dc.language.isoen_USen_US
dc.publisherASMEen_US
dc.subjectCu-to-Cu direct bondingen_US
dc.subjectcurrent-assisted bondingen_US
dc.subjectCu microbumpsen_US
dc.subjectelectromigrationen_US
dc.titleEnhanced Bonding by Applied Current in Cu-to-Cu Joints Fabricated Using 20 mu m Cu Microbumpsen_US
dc.typeArticleen_US
dc.relation.no4-
dc.relation.volume139-
dc.identifier.doi10.1115/1.4037474-
dc.relation.page1-7-
dc.relation.journalJOURNAL OF ELECTRONIC PACKAGING-
dc.contributor.googleauthorMa, Sung Woo-
dc.contributor.googleauthorShin, Chanho-
dc.contributor.googleauthorKim, Young-Ho-
dc.relation.code2017009022-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentDIVISION OF MATERIALS SCIENCE AND ENGINEERING-
dc.identifier.pidkimyh-
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MATERIALS SCIENCE AND ENGINEERING(신소재공학부) > Articles
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