Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 어영선 | - |
dc.date.accessioned | 2019-11-19T06:53:02Z | - |
dc.date.available | 2019-11-19T06:53:02Z | - |
dc.date.issued | 2019-02 | - |
dc.identifier.citation | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v. 9, No. 6, Page. 1133-1141 | en_US |
dc.identifier.issn | 2156-3950 | - |
dc.identifier.issn | 2156-3985 | - |
dc.identifier.uri | https://ieeexplore.ieee.org/document/8638969 | - |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/112395 | - |
dc.description.abstract | In this paper, over a broad frequency band, a novel transmission line characterization method for highly-lossy miniaturized integrated circuit interconnect lines is presented. Transmission lines (TLs) fabricated on lossy organic substrates are difficult to characterize in a broad frequency band due to frequency-dependent losses and resonances. Test TLs are fabricated using a package process that employs an organic substrate and then characterized by using a vector network analyzer (VNA) up to 40 GHz. TLs are modeled as a function of frequency combining the modified skin effect model with experimental -parameter data. Parallel admittance of TLs can be yielded by unifying the propagation constant with the frequency-variant resistance and inductance models, followed by TL characterization. It is verified that integrated circuit (IC) package interconnect lines can be reliably characterized up to high-frequencies. | en_US |
dc.language.iso | en_US | en_US |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | en_US |
dc.subject | Organic substrate | en_US |
dc.subject | signal integrity | en_US |
dc.subject | S-parameters | en_US |
dc.subject | transmission line (TL) modeling | en_US |
dc.title | IC Package Interconnect Line Characterization Based on Frequency-Variant Transmission Line Modeling and Experimental S-Parameters | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1109/TCPMT.2019.2898671 | - |
dc.relation.page | 1-1 | - |
dc.relation.journal | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | - |
dc.contributor.googleauthor | Kim, J. | - |
dc.contributor.googleauthor | Eo, Y. | - |
dc.relation.code | 2019002567 | - |
dc.sector.campus | E | - |
dc.sector.daehak | COLLEGE OF ENGINEERING SCIENCES[E] | - |
dc.sector.department | DIVISION OF ELECTRICAL ENGINEERING | - |
dc.identifier.pid | eo | - |
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