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IC Package Interconnect Line Characterization Based on Frequency-Variant Transmission Line Modeling and Experimental S-Parameters

Title
IC Package Interconnect Line Characterization Based on Frequency-Variant Transmission Line Modeling and Experimental S-Parameters
Author
어영선
Keywords
Organic substrate; signal integrity; S-parameters; transmission line (TL) modeling
Issue Date
2019-02
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Citation
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v. 9, No. 6, Page. 1133-1141
Abstract
In this paper, over a broad frequency band, a novel transmission line characterization method for highly-lossy miniaturized integrated circuit interconnect lines is presented. Transmission lines (TLs) fabricated on lossy organic substrates are difficult to characterize in a broad frequency band due to frequency-dependent losses and resonances. Test TLs are fabricated using a package process that employs an organic substrate and then characterized by using a vector network analyzer (VNA) up to 40 GHz. TLs are modeled as a function of frequency combining the modified skin effect model with experimental -parameter data. Parallel admittance of TLs can be yielded by unifying the propagation constant with the frequency-variant resistance and inductance models, followed by TL characterization. It is verified that integrated circuit (IC) package interconnect lines can be reliably characterized up to high-frequencies.
URI
https://ieeexplore.ieee.org/document/8638969http://repository.hanyang.ac.kr/handle/20.500.11754/112395
ISSN
2156-3950; 2156-3985
DOI
10.1109/TCPMT.2019.2898671
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > ELECTRICAL ENGINEERING(전자공학부) > Articles
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