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dc.contributor.author박진구-
dc.date.accessioned2019-11-11T05:15:26Z-
dc.date.available2019-11-11T05:15:26Z-
dc.date.issued2005-09-
dc.identifier.citation전기전자재료학회논문지, v. 18, No. 9, Page. 803-809en_US
dc.identifier.issn1226-7945-
dc.identifier.issn2288-3258-
dc.identifier.urihttp://kiss.kstudy.com/thesis/thesis-view.asp?key=2464312-
dc.identifier.urihttp://repository.hanyang.ac.kr/handle/20.500.11754/112050-
dc.language.isoko_KRen_US
dc.publisher한국전기전자재료학회en_US
dc.subjectRu CMPen_US
dc.subjectNoble metal CMPen_US
dc.subjectCANen_US
dc.subjectEtch rateen_US
dc.titleRuthenium CMP에서 Cerium Ammonium Nitrate와 알루미나 연마 입자가 연마 거동에 미치는 영향en_US
dc.title.alternativeEffect of Cerium Ammonium Nitrate and Alumina Abrasive Particles on Polishing Behavior in Ruthenium Chemical Mechanical Planarizationen_US
dc.typeArticleen_US
dc.relation.journal전기전자재료학회논문지-
dc.contributor.googleauthor이상호-
dc.contributor.googleauthor이승호-
dc.contributor.googleauthor강영재-
dc.contributor.googleauthor김인권-
dc.contributor.googleauthor박진구-
dc.relation.code2012212818-
dc.sector.campusE-
dc.sector.daehakCOLLEGE OF ENGINEERING SCIENCES[E]-
dc.sector.departmentDEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING-
dc.identifier.pidjgpark-
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COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
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