Repository at Hanyang UniversityCOLLEGE OF ENGINEERING SCIENCES[E](공학대학)MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과)Articles
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Ruthenium CMP에서 Cerium Ammonium Nitrate와 알루미나 연마 입자가 연마 거동에 미치는 영향
- Title
- Ruthenium CMP에서 Cerium Ammonium Nitrate와 알루미나 연마 입자가 연마 거동에 미치는 영향
- Other Titles
- Effect of Cerium Ammonium Nitrate and Alumina Abrasive Particles on Polishing Behavior in Ruthenium Chemical Mechanical Planarization
- Author
- 박진구
- Keywords
- Ru CMP; Noble metal CMP; CAN; Etch rate
- Issue Date
- 2005-09
- Publisher
- 한국전기전자재료학회
- Citation
- 전기전자재료학회논문지, v. 18, No. 9, Page. 803-809
- URI
- http://kiss.kstudy.com/thesis/thesis-view.asp?key=2464312https://repository.hanyang.ac.kr/handle/20.500.11754/112050
- ISSN
- 1226-7945; 2288-3258
- Appears in Collections:
- COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
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